Notice Information
Notice Title
Deposition Tools
Notice Description
- An ICP Plasma Etch system, with load lock, for etching III-V materials to shallow or standard (<10um) etch depths, and be capable of etching the following materials GaAs, GaN, InP, InSb/GaSb, SixNy, BCB and Polyimide - A High Density Plasma Etch system designed to etch strongly bonded materials, with load lock, capable of etching strongly bonded materials including SiO2 (>100um), Glass, SiNx,, SiC, GaN, PZT and AlN and Al2O3. Must operate with higher plasma density and at lower pressures than conventional ICP systems.
Lot Information
Lot 1
The requirement of the Plasma ETCH tools is to etch III-V semiconductor samples, wafers and other substrates, ranging in size from 10 x 10 mm up to 200mm diameter wafers. The requirement of the PECVD tool is to deposit films of dielectric materials onto semiconductor samples, wafers and other substrates, ranging in size from 10 x 10 mm up to 200mm diameter wafers. The supplier must provide all 3 systems, to criteria set out below, for the bid to be successful. Specification of Equipment An ICP Plasma Etch system, with load lock, for etching III-V materials to shallow or standard (<10um) etch depths, and be capable of etching the following materials GaAs, GaN, InP, InSb/GaSb, SixNy, BCB and Polyimide A High Density Plasma Etch system designed to etch strongly bonded materials, with load lock, capable of etching strongly bonded materials including SiO2 (>100um), Glass, SiNx,, SiC, GaN, PZT and AlN and Al2O3. Must operate with higher plasma density and at lower pressures than conventional ICP systems.
Notice Details
Publication & Lifecycle
- Open Contracting ID
- ocds-kuma6s-117762
- Publication Source
- Sell2Wales
- Latest Notice
- https://www.sell2wales.gov.wales/search/search_switch.aspx?ID=117762
- Current Stage
- Award
- All Stages
- Tender, Award
Procurement Classification
- Notice Type
- OJEU - F3 - Contract Award Notice
- Procurement Type
- Standard
- Procurement Category
- Goods
- Procurement Method
- Open
- Procurement Method Details
- Open procedure
- Tender Suitability
- Not specified
- Awardee Scale
- Large
Common Procurement Vocabulary (CPV)
- CPV Divisions
38 - Laboratory, optical and precision equipments (excl. glasses)
-
- CPV Codes
38000000 - Laboratory, optical and precision equipments (excl. glasses)
Notice Value(s)
- Tender Value
- £2,000,000 £1M-£10M
- Lots Value
- Not specified
- Awards Value
- Not specified
- Contracts Value
- £1,666,666 £1M-£10M
Notice Dates
- Publication Date
- 24 Mar 20223 years ago
- Submission Deadline
- 18 Feb 2022Expired
- Future Notice Date
- Not specified
- Award Date
- 24 Mar 20223 years ago
- Contract Period
- Not specified - Not specified
- Recurrence
- Not specified
Notice Status
- Tender Status
- Complete
- Lots Status
- Complete
- Awards Status
- Not Specified
- Contracts Status
- Active
Buyer & Supplier
Contracting Authority (Buyer)
- Main Buyer
- CARDIFF UNIVERSITY
- Contact Name
- Not specified
- Contact Email
- halea3@cardiff.ac.uk
- Contact Phone
- +44 2920879648
Buyer Location
- Locality
- CARDIFF
- Postcode
- CF24 0DE
- Post Town
- Cardiff
- Country
- Wales
-
- Major Region (ITL 1)
- TLL Wales
- Basic Region (ITL 2)
- TLL5 South East Wales
- Small Region (ITL 3)
- TLL52 Cardiff and Vale of Glamorgan
- Delivery Location
- TLL22 Cardiff and Vale of Glamorgan
-
- Local Authority
- Cardiff
- Electoral Ward
- Adamsdown
- Westminster Constituency
- Cardiff East
Further Information
Notice Documents
-
https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=JAN386144
Deposition Tools - - An ICP Plasma Etch system, with load lock, for etching III-V materials to shallow or standard (<10um) etch depths, and be capable of etching the following materials GaAs, GaN, InP, InSb/GaSb, SixNy, BCB and Polyimide - A High Density Plasma Etch system designed to etch strongly bonded materials, with load lock, capable of etching strongly bonded materials including SiO2 (>100um), Glass, SiNx,, SiC, GaN, PZT and AlN and Al2O3. Must operate with higher plasma density and at lower pressures than conventional ICP systems. -
https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=MAR393157
Deposition Tools - - An ICP Plasma Etch system, with load lock, for etching III-V materials to shallow or standard (<10um) etch depths, and be capable of etching the following materials GaAs, GaN, InP, InSb/GaSb, SixNy, BCB and Polyimide - A High Density Plasma Etch system designed to etch strongly bonded materials, with load lock, capable of etching strongly bonded materials including SiO2 (>100um), Glass, SiNx,, SiC, GaN, PZT and AlN and Al2O3. Must operate with higher plasma density and at lower pressures than conventional ICP systems.
Open Contracting Data Standard (OCDS)
View full OCDS Record for this contracting process
The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.
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