Award

Ask AI about this notice

Summarise, research or assess it with AI

View Markdown

Share this notice

Send this contract to a colleague

Chip Cleave & Break system

Cardiff University

This public procurement record has 2 releases in its history.

Award

27 Feb 2023 at 00:00

OJEU - F3 - Contract Award Notice
Tender

26 Aug 2022 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

Cardiff University has completed a procurement process for the acquisition of a Chip Cleave & Break system. The system is intended for use with Electronic and Optoelectronic devices across various material platforms. The procurement was conducted using an open procedure and has resulted in an active contract with S3-Alliance Ltd worth £278,000. The Chip Cleave & Break system project falls under the goods category and was awarded to S3-Alliance Ltd. The tender process was initiated on 27th February 2023 by Cardiff University.

The tender for the Chip Cleave & Break system by Cardiff University presents significant business opportunities, especially for SMEs in the technology and engineering sectors. Companies offering innovative tools and solutions for electronic device processing are well-suited to compete in this tender. The allocated contract value of £278,000 indicates a substantial business growth potential for the successful supplier, S3-Alliance Ltd. The procurement method chosen enables fair competition and transparency in the selection process, fostering a competitive business environment.

How relevant is this notice?

Notice Information

Notice Title

Chip Cleave & Break system

Notice Description

The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool

Lot Information

Lot 1

The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-kuma6s-124353
Publication Source
Sell2Wales
Latest Notice
https://www.sell2wales.gov.wales/search/search_switch.aspx?ID=124353
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
OJEU - F3 - Contract Award Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
SME

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£200,000 £100K-£500K
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
£278,000 £100K-£500K

Notice Dates

Publication Date
27 Feb 20233 years ago
Submission Deadline
26 Sep 2022Expired
Future Notice Date
Not specified
Award Date
23 Feb 20233 years ago
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Complete
Awards Status
Not Specified
Contracts Status
Active

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
Cardiff University
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
CARDIFF
Postcode
CF24 0DE
Postcode Area
Cardiff
Country
Wales
Major Region (ITL 1)
TLL Wales
Basic Region (ITL 2)
TLL5 South East Wales
Small Region (ITL 3)
TLL52 Cardiff and Vale of Glamorgan
Delivery Location
TLL22 Cardiff and Vale of Glamorgan
Local Authority
Cardiff
Electoral Ward
Adamsdown
Westminster Constituency
Cardiff East

Supplier Information

Number of Suppliers
1
Supplier Name

S3-Alliance Ltd

Further Information

Notice Documents

  • https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=AUG409828
    Chip Cleave & Break system - The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool
  • https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=MAR429421
    Chip Cleave & Break system - The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

JSON Markdown

The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

Loading OCDS record...