Notice Information
Notice Title
Chip Cleave & Break system
Notice Description
The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool
Lot Information
Lot 1
The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool
Notice Details
Publication & Lifecycle
- Open Contracting ID
- ocds-kuma6s-124353
- Publication Source
- Sell2Wales
- Latest Notice
- https://www.sell2wales.gov.wales/search/search_switch.aspx?ID=124353
- Current Stage
- Award
- All Stages
- Tender, Award
Procurement Classification
- Notice Type
- OJEU - F3 - Contract Award Notice
- Procurement Type
- Standard
- Procurement Category
- Goods
- Procurement Method
- Open
- Procurement Method Details
- Open procedure
- Tender Suitability
- Not specified
- Awardee Scale
- SME
Common Procurement Vocabulary (CPV)
- CPV Divisions
38 - Laboratory, optical and precision equipments (excl. glasses)
-
- CPV Codes
38000000 - Laboratory, optical and precision equipments (excl. glasses)
Notice Value(s)
- Tender Value
- £200,000 £100K-£500K
- Lots Value
- Not specified
- Awards Value
- Not specified
- Contracts Value
- £278,000 £100K-£500K
Notice Dates
- Publication Date
- 27 Feb 20232 years ago
- Submission Deadline
- 26 Sep 2022Expired
- Future Notice Date
- Not specified
- Award Date
- 23 Feb 20233 years ago
- Contract Period
- Not specified - Not specified
- Recurrence
- Not specified
Notice Status
- Tender Status
- Complete
- Lots Status
- Complete
- Awards Status
- Not Specified
- Contracts Status
- Active
Buyer & Supplier
Contracting Authority (Buyer)
- Main Buyer
- CARDIFF UNIVERSITY
- Contact Name
- Anthony Hale
- Contact Email
- halea3@cardiff.ac.uk, procurement@cardiff.ac.uk
- Contact Phone
- +44 2920879648
Buyer Location
- Locality
- CARDIFF
- Postcode
- CF24 0DE
- Post Town
- Cardiff
- Country
- Wales
-
- Major Region (ITL 1)
- TLL Wales
- Basic Region (ITL 2)
- TLL5 South East Wales
- Small Region (ITL 3)
- TLL52 Cardiff and Vale of Glamorgan
- Delivery Location
- TLL22 Cardiff and Vale of Glamorgan
-
- Local Authority
- Cardiff
- Electoral Ward
- Adamsdown
- Westminster Constituency
- Cardiff East
Further Information
Notice Documents
-
https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=AUG409828
Chip Cleave & Break system - The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool -
https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=MAR429421
Chip Cleave & Break system - The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool
Open Contracting Data Standard (OCDS)
View full OCDS Record for this contracting process
The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.
{
"tag": [
"compiled"
],
"id": "ocds-kuma6s-124353-2023-02-27T00:00:00Z",
"date": "2023-02-27T00:00:00Z",
"ocid": "ocds-kuma6s-124353",
"initiationType": "tender",
"parties": [
{
"id": "org-6",
"name": "Cardiff University",
"identifier": {
"legalName": "Cardiff University"
},
"address": {
"streetAddress": "Procurement Services, McKenzie House, 30-36 Newport Road",
"locality": "Cardiff",
"region": "UKL",
"postalCode": "CF24 0DE"
},
"contactPoint": {
"name": "Anthony Hale",
"email": "halea3@cardiff.ac.uk",
"telephone": "+44 2920879648",
"url": "https://in-tendhost.co.uk/cardiffuniversity/aspx/Home"
},
"roles": [
"buyer",
"centralPurchasingBody"
],
"details": {
"classifications": [
{
"id": "Body governed by public law",
"scheme": "TED_CA_TYPE"
},
{
"id": "09",
"description": "Education",
"scheme": "COFOG"
}
],
"url": "http://www.cardiff.ac.uk/business/why-work-with-us/for-suppliers"
}
},
{
"id": "org-2",
"name": "High Court",
"identifier": {
"legalName": "High Court"
},
"address": {
"streetAddress": "Royal Courts of Justice, The Strand",
"locality": "London",
"postalCode": "WC2A 2LL"
},
"contactPoint": {
"telephone": "+44 2079477501"
},
"roles": [
"reviewBody",
"mediationBody"
]
},
{
"id": "org-58",
"name": "Cardiff University",
"identifier": {
"legalName": "Cardiff University"
},
"address": {
"streetAddress": "Procurement Services, McKenzie House, 30-36 Newport Road",
"locality": "Cardiff",
"region": "UKL",
"postalCode": "CF24 0DE"
},
"contactPoint": {
"email": "procurement@cardiff.ac.uk",
"telephone": "+44 2920879648"
},
"roles": [
"buyer",
"centralPurchasingBody"
],
"details": {
"classifications": [
{
"id": "Body governed by public law",
"scheme": "TED_CA_TYPE"
},
{
"id": "09",
"description": "Education",
"scheme": "COFOG"
}
],
"url": "http://www.cardiff.ac.uk/business/why-work-with-us/for-suppliers"
}
},
{
"id": "org-247",
"name": "S3-Alliance Ltd",
"identifier": {
"legalName": "S3-Alliance Ltd"
},
"address": {
"streetAddress": "Beraghmore Road, Skeoge Industrial Estate",
"locality": "Londonderry",
"region": "UKN",
"postalCode": "BT488SE"
},
"contactPoint": {
"telephone": "+44 2871357760",
"faxNumber": "+44 2871357744"
},
"roles": [
"supplier"
],
"details": {
"scale": "sme"
}
},
{
"id": "org-3",
"name": "High Court",
"identifier": {
"legalName": "High Court"
},
"address": {
"streetAddress": "Royal Courts of Justice, The Strand",
"locality": "London",
"postalCode": "WC2A 2LL"
},
"contactPoint": {
"telephone": "+44 2079477501"
},
"roles": [
"reviewBody"
]
}
],
"buyer": {
"name": "Cardiff University",
"id": "org-58"
},
"tender": {
"id": "ocds-kuma6s-124353-tender-129446-CU.1013.TH",
"title": "Chip Cleave & Break system",
"description": "The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool",
"status": "complete",
"items": [
{
"id": "1",
"deliveryAddresses": [
{
"region": "UKL22"
},
{
"region": "UKL22"
}
],
"relatedLot": "1",
"additionalClassifications": [
{
"id": "38000000",
"scheme": "CPV"
}
]
}
],
"value": {
"amount": 200000,
"currency": "GBP"
},
"procurementMethod": "open",
"procurementMethodDetails": "Open procedure",
"mainProcurementCategory": "goods",
"submissionMethod": [
"electronicSubmission"
],
"submissionMethodDetails": "https://in-tendhost.co.uk/cardiffuniversity/aspx/Home",
"tenderPeriod": {
"endDate": "2022-09-26T12:00:00Z"
},
"awardPeriod": {
"startDate": "2022-09-26T12:00:00Z"
},
"documents": [
{
"id": "AUG409828",
"documentType": "contractNotice",
"title": "Chip Cleave & Break system",
"description": "The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool",
"url": "https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=AUG409828",
"format": "text/html"
},
{
"id": "economic",
"documentType": "economicSelectionCriteria"
},
{
"id": "technical",
"documentType": "technicalSelectionCriteria"
},
{
"id": "MAR429421",
"documentType": "awardNotice",
"title": "Chip Cleave & Break system",
"description": "The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool",
"url": "https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=MAR429421",
"format": "text/html"
}
],
"lots": [
{
"id": "1",
"description": "The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool",
"status": "complete",
"awardCriteria": {
"criteria": [
{
"type": "quality",
"name": "Quality",
"description": "70"
},
{
"type": "price",
"description": "30"
}
]
},
"hasOptions": false,
"submissionTerms": {
"variantPolicy": "notAllowed"
},
"contractPeriod": {
"durationInDays": 180
},
"hasRenewal": false
}
],
"bidOpening": {
"date": "2022-09-26T12:00:00Z",
"address": {
"streetAddress": "Online"
},
"description": "Two Senior Procurement Officers will open the tender (electronically) supervised by a Category Manager"
},
"communication": {
"atypicalToolUrl": "https://in-tendhost.co.uk/cardiffuniversity/aspx/Home"
},
"contractTerms": {
"hasElectronicPayment": true,
"hasElectronicOrdering": true,
"electronicInvoicingPolicy": "allowed"
},
"coveredBy": [
"GPA"
],
"submissionTerms": {
"languages": [
"en",
"cy"
],
"bidValidityPeriod": {
"durationInDays": 90
}
},
"classification": {
"id": "38000000",
"scheme": "CPV"
},
"hasRecurrence": false,
"legalBasis": {
"id": "32014L0024",
"scheme": "CELEX"
}
},
"language": "EN",
"description": "(WA Ref:129446)",
"links": [
{
"rel": "canonical",
"href": "https://api.sell2wales.gov.wales/v1?lang=cy/Notice?id=ocds-kuma6s-124353"
}
],
"noticetype": "OJEU - F3 - Contract Award Notice",
"awards": [
{
"id": "ocds-kuma6s-124353-award-129446-186",
"suppliers": [
{
"id": "org-247",
"name": "S3-Alliance Ltd"
}
],
"relatedLots": [
"1"
]
}
],
"contracts": [
{
"id": "ocds-kuma6s-124353-award-129446-186",
"awardID": "ocds-kuma6s-124353-award-129446-186",
"status": "active",
"value": {
"amount": 278000,
"currency": "GBP"
},
"dateSigned": "2023-02-23T00:00:00Z"
}
],
"relatedProcesses": [
{
"id": "1",
"relationship": [
"planning"
],
"scheme": "EU-OJ",
"identifier": "2022/S 167-475145"
}
],
"bids": {
"statistics": [
{
"id": "ocds-kuma6s-124353-bidsstatistic-129446-711",
"measure": "bids",
"value": 1,
"relatedLot": "1"
},
{
"id": "ocds-kuma6s-124353-bidsstatistic-129446-712",
"measure": "smeBids",
"value": 1,
"relatedLot": "1"
},
{
"id": "ocds-kuma6s-124353-bidsstatistic-129446-713",
"measure": "foreignBidsFromEU",
"value": 0,
"relatedLot": "1"
},
{
"id": "ocds-kuma6s-124353-bidsstatistic-129446-714",
"measure": "foreignBidsFromNonEU",
"value": 1,
"relatedLot": "1"
},
{
"id": "ocds-kuma6s-124353-bidsstatistic-129446-715",
"measure": "electronicBids",
"value": 1,
"relatedLot": "1"
}
]
}
}