Notice Information
Notice Title
Wafer Dicing Saw
Notice Description
Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.
Lot Information
Lot 1
Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.
Notice Details
Publication & Lifecycle
- Open Contracting ID
- ocds-r6ebe6-0000728982
- Publication Source
- Public Contracts Scotland
- Latest Notice
- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY479728
- Current Stage
- Award
- All Stages
- Tender, Award
Procurement Classification
- Notice Type
- PCS Notice - Website Contract Award Notice
- Procurement Type
- Standard
- Procurement Category
- Goods
- Procurement Method
- Open
- Procurement Method Details
- Open procedure
- Tender Suitability
- Not specified
- Awardee Scale
- Large
Common Procurement Vocabulary (CPV)
- CPV Divisions
43 - Machinery for mining, quarrying, construction equipment
-
- CPV Codes
43812000 - Sawing equipment
Notice Value(s)
- Tender Value
- Not specified
- Lots Value
- Not specified
- Awards Value
- Not specified
- Contracts Value
- £67,000 Under £100K
Notice Dates
- Publication Date
- 30 May 20233 years ago
- Submission Deadline
- 26 Apr 2023Expired
- Future Notice Date
- Not specified
- Award Date
- 26 May 20233 years ago
- Contract Period
- Not specified - Not specified
- Recurrence
- Not specified
Notice Status
- Tender Status
- Complete
- Lots Status
- Complete
- Awards Status
- Not Specified
- Contracts Status
- Active
Buyer & Supplier
Contracting Authority (Buyer)
- Main Buyer
- University of St Andrews
- Contact Name
- Available with D3 Tenders Premium →
- Contact Email
- Available with D3 Tenders Premium →
- Contact Phone
- Available with D3 Tenders Premium →
Buyer Location
- Locality
- GUARDBRIDGE
- Postcode
- KY16 0US
- Postcode Area
- Kirkcaldy
- Country
- Scotland
-
- Major Region (ITL 1)
- TLM Scotland
- Basic Region (ITL 2)
- TLM0 Eastern Scotland
- Small Region (ITL 3)
- TLM01 Clackmannanshire and Fife
- Delivery Location
- TLM72 Clackmannanshire and Fife
-
- Local Authority
- Fife
- Electoral Ward
- Tay Bridgehead
- Westminster Constituency
- North East Fife
Further Information
Notice Documents
-
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR476026
Wafer Dicing Saw - Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced. -
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY479728
Wafer Dicing Saw - Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.
Open Contracting Data Standard (OCDS)
The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.