Notice Information
Notice Title
NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
Notice Description
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
Lot Information
Lot 1
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The initial focus will be procuring equipment as a 3 cell solution as Cell 6, Cell 7 and Cell 8 of a production line to support die bonding, wire bonding and encapsulation and associated ancillaries required. The University is seeking a supplier to supply, deliver and commission all of the equipment to provide the following overall capability: Cell 6: Die Attach - Automatic die bonding - Vacuum oven curing - Plasma cleaning Cell 7: Interconnection - Multi-head wire bonding - Ultrasonic bonding Cell 8: Encapsulation - Overmoulding - Dam and fill encapsulation - Oven curing
Notice Details
Publication & Lifecycle
- Open Contracting ID
- ocds-r6ebe6-0000742450
- Publication Source
- Public Contracts Scotland
- Latest Notice
- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG486653
- Current Stage
- Planning
- All Stages
- Planning
Procurement Classification
- Notice Type
- OJEU - F1 - Prior Information Notice
- Procurement Type
- Standard
- Procurement Category
- Goods
- Procurement Method
- Not Specified
- Procurement Method Details
- Not specified
- Tender Suitability
- Not specified
- Awardee Scale
- Not specified
Common Procurement Vocabulary (CPV)
- CPV Divisions
31 - Electrical machinery, apparatus, equipment and consumables; lighting
-
- CPV Codes
31710000 - Electronic equipment
31712330 - Semiconductors
Notice Value(s)
- Tender Value
- £1,900,000 £1M-£10M
- Lots Value
- Not specified
- Awards Value
- Not specified
- Contracts Value
- Not specified
Notice Dates
- Publication Date
- 23 Aug 20232 years ago
- Submission Deadline
- Not specified
- Future Notice Date
- 2 Oct 2023Expired
- Award Date
- Not specified
- Contract Period
- Not specified - Not specified
- Recurrence
- Not specified
Notice Status
- Tender Status
- Planned
- Lots Status
- Planned
- Awards Status
- Not Specified
- Contracts Status
- Not Specified
Buyer & Supplier
Contracting Authority (Buyer)
- Main Buyer
- UNIVERSITY OF STRATHCLYDE
- Contact Name
- Not specified
- Contact Email
- jemma.wylie@strath.ac.uk
- Contact Phone
- +44 7811592949
Buyer Location
- Locality
- GLASGOW
- Postcode
- G1 1QE
- Post Town
- Glasgow
- Country
- Scotland
-
- Major Region (ITL 1)
- TLM Scotland
- Basic Region (ITL 2)
- TLM3 West Central Scotland
- Small Region (ITL 3)
- TLM32 Glasgow City
- Delivery Location
- TLM82 Glasgow City
-
- Local Authority
- Glasgow City
- Electoral Ward
- Anderston/City/Yorkhill
- Westminster Constituency
- Glasgow North East
Further Information
Notice Documents
-
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG486653
NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment. - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
Open Contracting Data Standard (OCDS)
View full OCDS Record for this contracting process
The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.
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