Planning

Supply, Delivery, Installation & Commissioning of Laser Wafer Dicing Equipment

UNIVERSITY OF STRATHCLYDE

This public procurement record has 1 release in its history.

Planning

01 Nov 2023 at 00:00

PCS Notice - Website Prior Information Notice
Summary of the contracting process

The University of Strathclyde, based in Glasgow, UK, has initiated a tender process for the procurement of Laser Wafer Dicing Equipment. The procurement is in the planning stage and is being led by the University's central purchasing body. The equipment is intended to support the university's expansion into the semiconductor advanced packaging sector, with a focus on power electronic semiconductors. The deadline for future notice is set for December 1, 2023.

This tender offers business growth opportunities for companies involved in supplying, delivering, installing, and commissioning advanced manufacturing equipment. Businesses in the goods category catering to the semiconductor industry would be well-suited to compete. The University of Strathclyde is particularly seeking suppliers who can provide equipment for laser wafer dicing and associated ancillaries to enhance its research and development capabilities in power electronic semiconductor manufacturing.

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Notice Information

Notice Title

Supply, Delivery, Installation & Commissioning of Laser Wafer Dicing Equipment

Notice Description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support a laser wafer dicing capability along with any and all associated ancillaries required

Lot Information

Lot 1

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement process will be procuring equipment for a laser wafer dicing capability along with any and all associated ancillaries required. The University is seeking a supplier to supply, deliver, install, and commission the equipment.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000749057
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=NOV491690
Current Stage
Planning
All Stages
Planning

Procurement Classification

Notice Type
PCS Notice - Website Prior Information Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Not Specified
Procurement Method Details
Not specified
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

31 - Electrical machinery, apparatus, equipment and consumables; lighting

CPV Codes

31710000 - Electronic equipment

31712330 - Semiconductors

Notice Value(s)

Tender Value
£500,000 £500K-£1M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
1 Nov 20232 years ago
Submission Deadline
Not specified
Future Notice Date
1 Dec 2023Expired
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Planned
Lots Status
Planned
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
UNIVERSITY OF STRATHCLYDE
Contact Name
Amanda McFarlane, Senior Procurement Specialist
Contact Email
amanda.mcfarlane@strath.co.uk
Contact Phone
Not specified

Buyer Location

Locality
GLASGOW
Postcode
G1 1XQ
Post Town
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=NOV491690
    Supply, Delivery, Installation & Commissioning of Laser Wafer Dicing Equipment - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support a laser wafer dicing capability along with any and all associated ancillaries required

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts. 

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