Award, Contract
NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
UNIVERSITY OF STRATHCLYDE
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Contract Timeline
- Publication Date
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3rd July 2024 00:00:00 AM
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Contract Summary
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
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Contract Details
- Open Contracting ID
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ocds-r6ebe6-0000753744
- Publication Source
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Public Contracts Scotland
- Procurement Stage
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Award, Contract
- Procurement Method
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Open
- Procurement Method Details
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Open Procedure
- Procurement Category
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Goods
- Tender Suitability
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- Framework / DPS
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Contract Classification
- CPV Code(s)
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31712330
- CPV Division(s)
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31 - Electrical machinery, apparatus, equipment and consumables; Lighting
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Awarding Authority
- Buyer Name
- Buyer Email
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jen.robertson@strath.ac.uk
- Buyer Phone
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+44 7811592949
- Buyer Address
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McCance Building, 16 Richmond Street
Glasgow
G1 1QE
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Awarded Supplier(s)