Planning

Wafer Dicing Equipment

UNIVERSITY OF STRATHCLYDE

  • Contract Timeline

    Publication Date

    30th April 2024 00:00:00 AM

  • Contract Summary

    NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The focus of this procurement activity to acquire wafer mount equipment.

  • Contract Details

    Open Contracting ID

    ocds-r6ebe6-0000765290

    Publication Source

    Public Contracts Scotland

    Procurement Stage

    Planning

    Procurement Method

    N/A

    Procurement Method Details

    N/A

    Procurement Category

    Goods

    Tender Suitability

    Framework / DPS

  • Contract Classification

    CPV Code(s)

    31712330

    CPV Division(s)

    31 - Electrical machinery, apparatus, equipment and consumables; Lighting

  • Awarding Authority

    UNIVERSITY OF STRATHCLYDE

    Buyer Name

    Buyer Email

    procurementenquiries@strath.ac.uk

    Buyer Phone

    +44 7811592949

    Buyer Address

    McCance Building, 16 Richmond Street

    Glasgow

    G1 1XQ

View contract on Public Contracts Scotland