Planning

Wafer Dicing Equipment

UNIVERSITY OF STRATHCLYDE

This public procurement record has 1 release in its history.

Planning

30 Apr 2024 at 00:00

PCS Notice - Website Prior Information Notice
Summary of the contracting process

The University of Strathclyde is planning a procurement process for Wafer Dicing Equipment. The procurement is part of expanding manufacturing capability into the semiconductor advanced packaging area, focusing on power electronic semiconductors. The equipment needed must be flexible to support various semiconductor designs and packaging requirements. The procurement stage is still in the planning phase, with a future notice date set for June 3, 2024, in Glasgow, UK. The main procurement category is goods, and the total contract value is £70,000.

This tender offers opportunities for businesses involved in manufacturing semiconductor equipment and technology. Companies specialising in power electronic semiconductors and semiconductor packaging would be well-suited to compete. The University of Strathclyde aims to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The procurement method is a tender initiated by the University, providing a chance for suppliers to offer solutions for wafer mount equipment in the semiconductor sector.

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Notice Information

Notice Title

Wafer Dicing Equipment

Notice Description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The focus of this procurement activity to acquire wafer mount equipment.

Lot Information

Lot 1

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, back grind, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement activity to acquire wafer mount equipment to allow semiconductor wafers to be mounted to / demounted from carriers to facilitate dicing and back grinding processes (in either order) in a manual / semi-automated fashion.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000765290
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR504235
Current Stage
Planning
All Stages
Planning

Procurement Classification

Notice Type
PCS Notice - Website Prior Information Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Not Specified
Procurement Method Details
Not specified
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

31 - Electrical machinery, apparatus, equipment and consumables; lighting

CPV Codes

31712330 - Semiconductors

Notice Value(s)

Tender Value
£70,000 Under £100K
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
30 Apr 20241 years ago
Submission Deadline
Not specified
Future Notice Date
3 Jun 2024Expired
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Planned
Lots Status
Planned
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
UNIVERSITY OF STRATHCLYDE
Contact Name
Not specified
Contact Email
procurementenquiries@strath.ac.uk
Contact Phone
+44 7811592949

Buyer Location

Locality
GLASGOW
Postcode
G1 1XQ
Post Town
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR504235
    Wafer Dicing Equipment - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The focus of this procurement activity to acquire wafer mount equipment.

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts. 

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