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Supply, Delivery and Installation of wafer dicing kit for NMIS

University of Strathclyde

This public procurement record has 2 releases in its history.

Award

16 Jan 2025 at 00:00

OJEU - F3 - Contract Award Notice
Tender

19 Jun 2024 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde has completed the procurement process for the "Supply, Delivery and Installation of wafer dicing kit for NMIS." This tender falls under the education industry category and is located in Glasgow, UK (region UKM82). The procurement process followed an open procedure and reached the award stage on 16 January 2025. The contract, valued at £305,414, was signed on 4 December 2024. This procurement supports the expansion of the National Manufacturing Institute Scotland's (NMIS) capabilities into semiconductor advanced packaging for power electronic semiconductors, including establishing a facility equipped with the latest technology in a clean room environment.

This tender presents significant opportunities for businesses involved in the semiconductor and power electronics sectors. Particularly, suppliers of advanced manufacturing equipment suited for semiconductor packaging processes are well-suited to compete. The awarded contract to S3 Alliance Ltd, a small to medium-sized enterprise (SME) located in Derry, illustrates the potential for SMEs to secure substantial contracts. Businesses with expertise in manufacturing, packaging, and technology provision for power electronics and those capable of delivering flexible and state-of-the-art equipment stand to benefit from similar future opportunities. The inclusive approach of NMIS, making the facility available to academic and industrial partners across the United Kingdom, further enhances prospects for businesses looking to engage in collaborative and innovative projects.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of wafer dicing kit for NMIS

Notice Description

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.

Lot Information

Saw Dicing

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 1 - Saw Dicing

Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

Laser Dicing

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 2 - Laser Dicing

Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

Scribe & Break

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 3 - Scribe & Break

Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000769827
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JAN521894
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
OJEU - F3 - Contract Award Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
SME

Common Procurement Vocabulary (CPV)

CPV Divisions

31 - Electrical machinery, apparatus, equipment and consumables; lighting

CPV Codes

31712330 - Semiconductors

Notice Value(s)

Tender Value
£1,000,000 £1M-£10M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
£305,414 £100K-£500K

Notice Dates

Publication Date
16 Jan 20251 years ago
Submission Deadline
22 Jul 2024Expired
Future Notice Date
Not specified
Award Date
4 Dec 20241 years ago
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Active, Complete
Awards Status
Not Specified
Contracts Status
Active

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Supplier Information

Number of Suppliers
1
Supplier Name

S3 Alliance Ltd

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUN507815
    Supply, Delivery and Installation of wafer dicing kit for NMIS - The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.
  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JAN521894
    Supply, Delivery and Installation of wafer dicing kit for NMIS - The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.

Open Contracting Data Standard (OCDS)

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