Planning

Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS)

UNIVERSITY OF STRATHCLYDE

This public procurement record has 1 release in its history.

Summary of the contracting process

The University of Strathclyde, located in Glasgow, is in the planning stage for a procurement process focused on expanding the National Manufacturing Institute of Scotland’s (NMIS) manufacturing capabilities in the semiconductor advanced packaging area. The tender, titled "Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS)," falls under the Education industry category and covers procurement of equipment for wafer laminating, back grinding, polishing, and cleaning with an estimated value range between GBP1.2m to GBP2m. The procurement activity is scheduled to proceed with the preliminary market consultation ending at 12 noon on 10th April 2025, and the future notice date set for 22nd April 2025.

This tender offers significant opportunities for businesses involved in the manufacturing of semiconductor equipment and services, specifically those capable of supplying turnkey solutions for wafer processing. Companies with expertise in semiconductor technologies, advanced packaging, and cleanroom solutions are well-suited to compete for this contract. This opportunity can enable businesses to contribute to NMIS's goal of creating a high-tech research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors, fostering growth and innovation in this sector.

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Notice Title

Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS)

Notice Description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. This procurement campaign focuses on the turnkey supply of a wafer laminator, wafer back grinding, wafer polishing and wafer cleaning capability. Estimated value range GBP1.2m-GBP2m

Lot Information

Lot 1

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, thin, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus will be procuring equipment as a turnkey to support, wafer back grinding, wafer polishing, and wafer cleaning. The capability will allow rough and fine dry polishing as well as rough and fine Chemical Mechanical Polishing. This will also include the requirement for ancillary equipment to provide services to these processes, including but not limited to water. The cleanroom facility has a limited water supply and waste water capability and so closed loop systems are preferred wherever possible. The necessary services of Electrical power, CDA and Nitrogen will be available, and plant to provide these services is not in scope for this procurement activity. Wherever necessary, suitable sources of vacuum should be included.

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000795012
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR527305
Current Stage
Planning
All Stages
Planning

Procurement Classification

Notice Type
PCS Notice - Website Prior Information Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Not Specified
Procurement Method Details
Not specified
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)


CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£1,200,000 £1M-£10M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
1 Apr 202510 months ago
Submission Deadline
Not specified
Future Notice Date
22 Apr 2025Expired
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Planned
Lots Status
Planned
Awards Status
Not Specified
Contracts Status
Not Specified

Contracting Authority (Buyer)

Main Buyer
UNIVERSITY OF STRATHCLYDE
Contact Name
Rene de Sousa
Contact Email
rene.de-sousa@strath.ac.uk
Contact Phone
Not specified

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Post Town
Glasgow
Country
Scotland

Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
Not specified

Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR527305
    Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS) - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. This procurement campaign focuses on the turnkey supply of a wafer laminator, wafer back grinding, wafer polishing and wafer cleaning capability. Estimated value range GBP1.2m-GBP2m

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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