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Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT

University of Strathclyde

This public procurement record has 2 releases in its history.

Award

13 Aug 2025 at 01:00

OJEU - F3 - Contract Award Notice
Tender

20 May 2025 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde, located in Glasgow, UK, recently completed the procurement process for the "Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT". This contract is part of a publicly funded project aimed at establishing an advanced power electronics packaging facility within the National Manufacturing Institute Scotland. The awarded contract, valued at £1,005,000, was executed through an open procedure under the goods procurement category, with Disco Hi-Tech UK Ltd confirmed as the supplier. Significant dates include the signing of the contract on 30th July 2025. The tendering period ended on 20th June 2025. This project targets the Education industry and is designed to support semiconductor research and development across the UK.

This tender provides considerable opportunities for businesses involved in the Power Electronics sector, particularly those specialising in semiconductor manufacturing technologies. Companies that offer innovative solutions in wafer thinning, polishing, and cleaning systems are well-suited to engage with such contracts. The initiative not only provides an avenue for supplying high-efficiency grinding and polishing equipment but also encourages collaboration with academic and industrial partners throughout the UK. The facilities will be available to numerous research and manufacturing projects, enhancing capacity and innovation in the industry. Competing in this tender aligns with the strategic growth initiatives of businesses aiming to expand their reach in high-tech and research-driven engineering sectors.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT

Notice Description

The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems. High-efficiency grinder/polisher for wafers A Deionised Water Recycling Unit Automatic Cleaning System for wafers

Lot Information

Lot 1

The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000799129
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG536956
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
OJEU - F3 - Contract Award Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Large

Common Procurement Vocabulary (CPV)

CPV Divisions

31 - Electrical machinery, apparatus, equipment and consumables; lighting

CPV Codes

31710000 - Electronic equipment

31712330 - Semiconductors

Notice Value(s)

Tender Value
£2,000,000 £1M-£10M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
£1,005,000 £1M-£10M

Notice Dates

Publication Date
13 Aug 20251 years ago
Submission Deadline
20 Jun 2025Expired
Future Notice Date
Not specified
Award Date
30 Jul 20251 years ago
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Complete
Awards Status
Not Specified
Contracts Status
Active

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Supplier Information

Number of Suppliers
1
Supplier Name

Disco Hi-Tech UK Ltd

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY530711
    Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT - The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems. High-efficiency grinder/polisher for wafers A Deionised Water Recycling Unit Automatic Cleaning System for wafers
  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG536956
    Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT - The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems. High-efficiency grinder/polisher for wafers A Deionised Water Recycling Unit Automatic Cleaning System for wafers

Open Contracting Data Standard (OCDS)

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