Award

Bond Tester

COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED

This public procurement record has 2 releases in its history.

Award

09 Jan 2020 at 11:41

Award Notice
Tender

17 Sep 2019 at 09:38

Tender Notice
Summary of the contracting process

The Compound Semiconductor Applications Catapult Limited has awarded a contract for the supply of a "Bond Tester" to facilitate a prototype package assembly and testing facility for RF, Photonics, and Power compound semiconductor devices. The procurement method was an open procedure, with a contract value of approximately £70,000. This procurement process was completed on 21st October 2019, following the publication of the tender notice on 17th September 2019. The contract will commence on 4th October 2019 and is set to conclude on 3rd October 2022, with delivery taking place at the CSA Catapult Innovation Centre in Newport, Wales.

This opportunity is particularly relevant for small and medium-sized enterprises (SMEs) specialising in electronic equipment and laboratory instrumentation. Businesses with expertise in die bonding machinery, prototype assembly, and testing services will find a suitable environment to showcase their innovations and capabilities. Engaging with this contract could facilitate growth by allowing successful bidders to contribute to pioneering semiconductor developments, thereby establishing valuable industry connections and enhancing their market visibility.

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Notice Information

Notice Title

Bond Tester

Notice Description

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards. The bond test system shall allow the CSA Catapult to perform in-house measurements of die bonded (bonding of a chip to a substrate using a variety of attachment techniques) and wire bonded (mechanically attached wires to connect the chip and substrate) prototype samples. The equipment is intended to provide results of the bonded interface as the quality of the bond is an indicator of the overall mechanical quality of a part. The system shall also be capable of testing for adhesion strength, stress and strain capability of new materials over a range of low to high temperature applications. This will be used for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions involving introduction of novel material properties. The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation. The Catapult may also purchase additional, related services. Additional information: To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2019-028 in the subject field.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-b5fd17-0a4d3aa7-7646-4209-b910-7aa571d2afbb
Publication Source
Contracts Finder
Latest Notice
https://www.contractsfinder.service.gov.uk/Notice/ea0de4d0-e826-4947-8c4b-c9740ee50f15
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
Award Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure (below threshold)
Tender Suitability
SME
Awardee Scale
SME

Common Procurement Vocabulary (CPV)

CPV Divisions

31 - Electrical machinery, apparatus, equipment and consumables; lighting

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

31710000 - Electronic equipment

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£70,000 Under £100K
Lots Value
Not specified
Awards Value
£69,950 Under £100K
Contracts Value
Not specified

Notice Dates

Publication Date
9 Jan 20206 years ago
Submission Deadline
30 Sep 2019Expired
Future Notice Date
Not specified
Award Date
20 Oct 20196 years ago
Contract Period
21 Oct 2019 - 3 Oct 2022 2-3 years
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Not Specified
Awards Status
Active
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
Contact Name
Not specified
Contact Email
procurement@csa.catapult.org.uk
Contact Phone
Not specified

Buyer Location

Locality
NEWPORT
Postcode
NP10 8BE
Post Town
Newport
Country
Wales
Major Region (ITL 1)
TLL Wales
Basic Region (ITL 2)
TLL5 South East Wales
Small Region (ITL 3)
TLL54 Monmouthshire and Newport
Delivery Location
Not specified
Local Authority
Newport
Electoral Ward
Tredegar Park and Marshfield
Westminster Constituency
Newport West and Islwyn

Supplier Information

Number of Suppliers
1
Supplier Name

INSETO (UK

Further Information

Notice Documents

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts. 

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