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UKRI-3154 Indium deposition system

UK Research & Innovation

This public procurement record has 2 releases in its history.

Award

05 Jan 2024 at 16:06

Award Notice
Tender

27 Sep 2023 at 12:07

Tender Notice
Summary of the contracting process

The UK Research & Innovation has completed a procurement process for an Indium deposition system under the goods category. The tender, titled "UKRI-3154 Indium deposition system", aimed to provide equipment capable of depositing on multiple substrates per day for the STFC Interconnect. The procurement stage was marked as "cancelled", with a contract value of 185,067 GBP signed on December 20, 2023. The tender was associated with the CPV code 14763000 for Indium and was open for business opportunities in the Oxfordshire region.

This tender by UK Research & Innovation presents a business growth opportunity for SMEs operating in the goods category, particularly those involved in electronic and detector assembly techniques. With a focus on providing advanced equipment for surface preparation and deposition processes, businesses specialised in semiconductor wafers and die production may find this tender suitable. The UKRI's procurement process, although marked as cancelled, reflects the organisation's commitment to driving innovation in scientific communities and external collaborations, potentially leading to future procurement opportunities in related fields.

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Notice Information

Notice Title

UKRI-3154 Indium deposition system

Notice Description

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

Lot Information

Lot 1

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-040425
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/000402-2024
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
SME

Common Procurement Vocabulary (CPV)

CPV Divisions

14 - Mining, basic metals and related products

CPV Codes

14763000 - Indium

Notice Value(s)

Tender Value
£320,000 £100K-£500K
Lots Value
£320,000 £100K-£500K
Awards Value
Not specified
Contracts Value
£185,067 £100K-£500K

Notice Dates

Publication Date
5 Jan 20242 years ago
Submission Deadline
2 Nov 2023Expired
Future Notice Date
Not specified
Award Date
20 Dec 20232 years ago
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Cancelled
Awards Status
Active
Contracts Status
Active

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
UK Research & Innovation
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
SWINDON
Postcode
SN2 1FL
Postcode Area
Swindon
Country
England
Major Region (ITL 1)
TLK South West (England)
Basic Region (ITL 2)
TLK7 Gloucestershire and Wiltshire
Small Region (ITL 3)
TLK71 Swindon
Delivery Location
TLJ14 Oxfordshire CC
Local Authority
Swindon
Electoral Ward
Rodbourne Cheney
Westminster Constituency
Swindon North

Supplier Information

Number of Suppliers
1
Supplier Name

HHV Ltd

Further Information

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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