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Supply, Delivery and Installation of wafer dicing kit for NMIS

University of Strathclyde

This public procurement record has 2 releases in its history.

Award

16 Jan 2025 at 08:21

Award Notice
Tender

19 Jun 2024 at 10:22

Tender Notice
Summary of the contracting process

The University of Strathclyde, located in Glasgow, is conducting a procurement process for the "Supply, Delivery and Installation of wafer dicing kit for NMIS". This falls under the semiconductors industry category and aims at expanding the National Manufacturing Institute Scotland's capabilities in semiconductor advanced packaging. This tender involves three key lots: "Saw Dicing", "Laser Dicing", and "Scribe & Break", with associated equipment to be installed at an NMIS site in an ISO-7 clean room environment. The tender is currently in the award stage, with an award granted to S3 Alliance Ltd on 4th December 2024 for the "Scribe & Break" lot. The main procurement method used was an open procedure.

This tender offers significant growth opportunities for businesses involved in the semiconductor and advanced manufacturing sectors. The required equipment will support a wide variety of power electronic semiconductor designs and packaging requirements, providing opportunities for suppliers of sophisticated technology solutions. Businesses specialising in semiconductor equipment, clean room technology, and related services would be well-suited to compete. Moreover, the anticipated use of this facility by both academic and industrial partners across the UK, including other catapult centres, underscores the potential for extensive collaboration and market expansion. With community benefits also considered, this procurement promotes sustainable business growth and societal impact.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of wafer dicing kit for NMIS

Notice Description

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.

Lot Information

Saw Dicing

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 1 - Saw Dicing

Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

Laser Dicing

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 2 - Laser Dicing

Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

Scribe & Break

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 3 - Scribe & Break

Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-047100
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/001435-2025
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
SME

Common Procurement Vocabulary (CPV)

CPV Divisions

31 - Electrical machinery, apparatus, equipment and consumables; lighting

CPV Codes

31712330 - Semiconductors

Notice Value(s)

Tender Value
£1,000,000 £1M-£10M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
£305,414 £100K-£500K

Notice Dates

Publication Date
16 Jan 20251 years ago
Submission Deadline
22 Jul 2024Expired
Future Notice Date
Not specified
Award Date
4 Dec 20241 years ago
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Active, Cancelled
Awards Status
Active
Contracts Status
Active

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XQ
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Supplier Information

Number of Suppliers
1
Supplier Name

S3 Alliance Ltd

Further Information

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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