Supply, Delivery and Installation of Sinter Bonding Capability

UNIVERSITY OF STRATHCLYDE

This public procurement record has 2 releases in its history.

Award

13 May 2026 at 12:42

Tender

17 Dec 2025 at 15:52

Summary of the contracting process

The University of Strathclyde is advancing its procurement process for the supply, delivery, and installation of sinter bonding capability as part of the National Manufacturing Institute Scotland's (NMIS) initiative to expand its manufacturing capabilities into the semiconductor advanced packaging sector. This procurement is categorised under 'Laboratory, optical and precision equipments,' with the specific procurement being goods. Conducted through an open procedure, the tender phase is currently active, with a submission deadline set for 26th January 2026. The equipment is intended to be delivered to Glasgow in region UKM82, supporting a range of power electronic semiconductor designs. The procurement value for this active tender is approximately GBP 900,000.

This procurement presents significant opportunities for businesses specialising in advanced semiconductor packaging technologies. Companies offering innovative sintering technologies with capabilities for flexible R&D and medium-scale production would be particularly suited to compete. There is an emphasis on automated handling solutions and the ability to work under specialised atmospheres, which may facilitate long-term partnerships with NMIS as the facility grows. Business growth can be achieved by leveraging the opportunity to work with NMIS, secured by high-quality and cost-effective solutions. Bidders must demonstrate previous experience and have a financial turnover meeting specified criteria to mitigate any financial risks.

How relevant is this notice?

Notice Title

Supply, Delivery and Installation of Sinter Bonding Capability

Notice Description

National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

Lot Information

Lot 1

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement activity is to acquire a sinter bonding press that is versatile to support both R&D activities and medium volume production. In the R&D context we require a capability that allows flexible exploration of tooling to achieve different package arrangements, while keeping tool costs at a minimum. In the medium scale production context we require a capability that includes automated handling solutions such that it can be fed by a magazine unstacker, and can feed a magazine stacker. In either context we require the ability to form bonds under inert atmosphere or forming gas, control the pre-heating and post-cooling ramp profile of sinter bonded assemblies and collect detailed sensor-driven time-histories of temperature and pressure for each bonding operation.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-05f82e
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/043912-2026
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
SME

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)


CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£900,000 £500K-£1M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
£819,990 £500K-£1M

Notice Dates

Publication Date
13 May 20261 months ago
Submission Deadline
26 Jan 2026Expired
Future Notice Date
Not specified
Award Date
23 Mar 20263 months ago
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Cancelled
Awards Status
Active
Contracts Status
Active

Contracting Authority (Buyer)

Main Buyer
UNIVERSITY OF STRATHCLYDE
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Post Town
Glasgow
Country
Scotland

Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City

Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Supplier Information

Number of Suppliers
1
Supplier Name

INSETO

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

JSON Markdown

The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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