Tender

Ask AI about this notice

Summarise, research or assess it with AI

View Markdown

Share this notice

Send this contract to a colleague

Supply, Delivery and Installation of Solder Jetting Equipment

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

30 Jul 2026 at 10:59

Tender Notice
Summary of the contracting process

The University of Strathclyde is procuring solder jetting equipment for the National Centre for Advanced Semiconductor Packaging (NCASP). The requirement covers the supply, delivery and installation of a solder jetting capability for processing photonic and semiconductor devices so they can be integrated into advanced packages. It supports the development of a sovereign, open-access UK facility for advanced semiconductor packaging, helping device designers move from research towards scalable domestic production, testing and metrology. The equipment will be delivered and installed in Glasgow. This is a goods procurement, covering laboratory, optical and precision equipment. The contract may also include additional deliveries, partial replacement of supplied equipment or installations, and extensions to existing supplies and installations at the authority’s discretion. Community benefits form part of the requirement.

The procurement has reached tender: the University of Strathclyde invited offers through an open procedure. Bids had to be submitted electronically in English by 31 August 2026 at 12:00 BST. The contract period is 720 days, with a possible 12-month renewal where required for maintenance and warranty. Bids must remain valid for 180 days after the submission deadline. Evaluation is based on quality at 60% and price at 40%; variants are not permitted. The buyer may request additional deliveries or extensions to existing supplies and installations. Electronic ordering and electronic payment are supported, and electronic invoicing is allowed. The bid opening and planned start of the award period were set for 31 August 2026 at 12:00 BST.

This opportunity suits equipment manufacturers, specialist laboratory and precision-equipment suppliers, and installation teams with direct experience of solder jetting or comparable semiconductor and photonics production equipment. Suppliers should be able to provide three examples demonstrating relevant experience in delivering the required equipment. Financial capacity is important: bidders must have achieved average annual turnover of at least £1,184,000 over the previous three years. The successful supplier must maintain, or commit to obtaining before contract commencement, employer’s liability insurance of £10 million, public and product liability insurance of £10 million, and professional indemnity insurance of £2 million. The work suits an established supplier able to manage equipment supply, delivery, installation, maintenance and warranty support, with capacity for additional deliveries or extensions.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Solder Jetting Equipment

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-06d74c
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/072058-2026
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
30 Jul 20262 months ago
Submission Deadline
31 Aug 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

JSON Markdown

The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

Loading OCDS record...