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Supply, Delivery and Installation of Hermetic Sealing Kit

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

30 Jul 2026 at 16:38

Tender Notice
Summary of the contracting process

The University of Strathclyde is buying an advanced hermetic sealing capability for the National Centre for Advanced Semiconductor Packaging. The requirement covers the supply, delivery and installation of equipment for seam sealing and projection welding of hermetic packages used in photonic and advanced semiconductor packaging. It is laboratory, optical and precision equipment (CPV 38000000), classified as goods. The capability is intended to support a sovereign, open-access UK packaging facility, helping innovators move from device design to higher-volume packaging, testing and metrology. The equipment will be delivered and installed in Glasgow. The requirement includes community benefits, with the expected benefits described in the procurement documents. Electronic ordering and electronic payment will be available, and electronic invoicing will be allowed.

The process has reached tender: the University of Strathclyde invited offers through an open procedure, with electronic submission in English. The tender submission deadline is 1 September 2026 at 12:00 BST. Bids must remain valid for 180 days from the submission deadline, and bids are scheduled to be opened at the same time. The contract period is 720 days, with a possible 12-month renewal if required for maintenance and warranty. The buyer may also request additional deliveries, including partial replacement or extensions to existing supplies and installations. There is one lot. Evaluation is weighted equally between quality and price, at 50% each. Variants are not permitted.

This opportunity suits suppliers that design, manufacture, install and support hermetic sealing equipment for semiconductor, photonics or other precision packaging applications. Bidders must provide three examples demonstrating relevant experience in delivering the required equipment. The financial threshold is an average annual turnover of at least £1,072,000 over the previous three years. Suppliers must hold, or commit to obtaining before contract commencement, employer’s compulsory liability insurance of £10 million, public and product liability insurance of £10 million, and professional risk indemnity insurance of £2 million. The successful supplier will need the capability to deliver and install the equipment, support any maintenance and warranty requirements, and accommodate potential replacement or extension orders.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Hermetic Sealing Kit

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-06d818
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/072390-2026
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
30 Jul 20262 months ago
Submission Deadline
1 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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