Tender

Ask AI about this notice

Summarise, research or assess it with AI

View Markdown

Share this notice

Send this contract to a colleague

Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

31 Jul 2026 at 17:02

Tender Notice
Summary of the contracting process

The University of Strathclyde is procuring an automatic die inspection sorter for photonics packaging applications. The equipment will support the National Centre for Advanced Semiconductor Packaging, an industry-led facility intended to connect UK device design with domestic high-volume semiconductor packaging, testing and metrology. The requirement covers the supply, delivery, installation and commissioning of laboratory, optical and precision equipment. Delivery and associated activity will be in Glasgow. The procurement is for goods and includes additional deliveries, which may involve partial replacement of supplies or installations or extensions to existing supplies and installations. Community benefits form part of the requirement, with the expected benefits described in the procurement documents.

The process has reached tender: the University of Strathclyde invited offers through an open procedure. It is one lot, with electronic submission in English and no variants permitted. The estimated value is £1,160,000. Bids had to be submitted by 1 September 2026 at 12:00, with bid opening and the start of the award period scheduled for the same time. The contract period is 720 days, with a possible 12-month renewal where required for maintenance and warranty. Evaluation is split equally between quality and price, at 50% each. Bids must remain valid for 180 days. Electronic ordering and payment are provided for, and electronic invoicing is allowed.

This opportunity suits equipment manufacturers, specialist laboratory and precision-technology suppliers, and systems integrators with experience delivering automatic inspection and sorting equipment for photonics or semiconductor packaging. Bidders must provide three examples demonstrating relevant experience in delivering the required equipment. They must have had average annual turnover of at least £2,320,000 over the previous three years, supporting the buyer’s assessment of financial and supply-chain resilience. The successful supplier must maintain, or be able to obtain before contract start, employers’ liability insurance of £10 million, public and product liability insurance of £10 million, and professional risk indemnity insurance of £2 million. Community-benefit delivery should also be considered.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-06d94d
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/072912-2026
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£1,160,000 £1M-£10M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
31 Jul 20262 months ago
Submission Deadline
1 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

JSON Markdown

The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

Loading OCDS record...