This public procurement record has 1 release in its history.

Tender

03 Aug 2026 at 10:19

Summary of the contracting process

The University of Strathclyde is buying an optical alignment and packaging system for photonics packaging applications. The equipment must support active and passive alignment functions, forming part of the National Centre for Advanced Semiconductor Packaging. The wider purpose is to help create a UK-based, open-access capability for advanced semiconductor packaging, linking device design with domestic packaging, testing and metrology. This is a goods procurement covering laboratory, optical and precision equipment. Supply, delivery and installation are required in Glasgow. The requirement is presented as one package rather than separate lots, so suppliers would need to provide the complete system and associated installation. The buyer also requires electronic ordering and allows electronic invoicing and electronic payment. Community benefits form part of the requirement, with the expected benefits described in the procurement documents.

The procurement has reached tender: the University of Strathclyde invited offers through an open procedure. It comprises one lot and uses electronic submission in English. Bids were required by 4 September 2026 at 12:00, with bid opening and the start of the award period set for the same time. The contract period is 720 days, with a possible 12-month renewal where required for maintenance and warranty. The buyer may request additional deliveries, including partial replacement of supplies or installations or extensions to existing supplies and installations. Variants are not allowed, and bids must remain valid for 180 days after the submission deadline. Evaluation is weighted 60% for quality and 40% for price. The procedure is covered by the Government Procurement Agreement.

This opportunity suits suppliers of specialist photonics, semiconductor packaging, optical alignment or precision laboratory equipment that can design, supply, install and support a complete system. Bidders must demonstrate relevant delivery experience through three examples involving comparable equipment. The buyer expects suppliers to have an average annual turnover of at least £1,834,000 over the last three years, indicating a requirement for established financial capacity and supply-chain resilience. The successful supplier must maintain, or be able to obtain before contract commencement, employer’s liability insurance of £10 million, public and product liability insurance of £10 million, and professional risk indemnity insurance of £2 million. The opportunity is particularly relevant to manufacturers, specialist equipment integrators and authorised technical partners with photonics packaging expertise, installation capability and maintenance or warranty support.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Optical Alignment & Packaging System

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-06d9a6
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/073040-2026
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)


CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
3 Aug 20262 months ago
Submission Deadline
4 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland

Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City

Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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