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Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

03 Aug 2026 at 16:39

Tender Notice
Summary of the contracting process

The University of Strathclyde is procuring an automated laser chip burn-in tester for the National Centre for Advanced Semiconductor Packaging. The requirement covers the supply, delivery and installation of laboratory, optical and precision equipment capable of automated burn-in testing of semiconductor chips. The equipment will support an open-access, industry-led scale-up facility linking UK device design with high-volume semiconductor packaging, testing and metrology. The wider purpose is to strengthen domestic capability for photonics and power electronics, reduce reliance on overseas outsourced semiconductor assembly and test facilities, and protect sensitive technologies and intellectual property. Delivery and installation will take place in Glasgow. Community benefits form part of the requirement, with the expected benefits described in the procurement requirements.

The procurement has reached tender: the University of Strathclyde invited offers through an open procedure. Bids must be submitted electronically in English by 7 September 2026 at 12:00. The tender is evaluated on quality, weighted at 60%, and price, weighted at 40%; variants are not allowed. The contract is planned to run for 720 days, with a possible 12-month renewal where required for maintenance and warranty. The authority may also request additional deliveries for partial replacement or extensions to the supplies and installations. Bids must remain valid for 180 days after the submission deadline. The bid opening and planned start of the award period are both scheduled for 7 September 2026 at 12:00. Electronic ordering and payment will be used, and electronic invoicing is permitted.

This opportunity suits suppliers with specialist experience in semiconductor, photonics, electronics or precision laboratory equipment, particularly businesses able to design, manufacture, supply, install and support automated laser testing systems. Bidders must provide three examples demonstrating relevant experience delivering the required equipment. The successful supplier will need the financial strength to support a complex equipment and installation requirement and an associated supply chain. An average annual turnover of at least £1.3 million over the last three years is required. The contractor must hold, or commit to obtain before contract commencement, employer’s liability insurance of £10 million, public and product liability insurance of £10 million, and professional indemnity insurance of £2 million. Suppliers able to provide maintenance and warranty support are especially relevant because renewal may depend on those services.

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Notice Information

Notice Title

Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-06da5b
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/073369-2026
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
3 Aug 20262 months ago
Submission Deadline
7 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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