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Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

06 Aug 2026 at 09:01

Tender Notice
Summary of the contracting process

The University of Strathclyde is buying one Inductively Coupled Plasma Chemical Vapour Deposition system, including its supply, delivery and installation. This is specialist laboratory, optical and precision equipment for the National Centre for Advanced Semiconductor Packaging, an industry-led facility intended to help UK photonics and power-electronics innovators move from device design to scalable domestic semiconductor packaging, testing and metrology. The equipment will support advanced packaging capability and reduce reliance on overseas outsourced semiconductor assembly and test facilities. Delivery is in Glasgow. The requirement is for goods, with electronic ordering and electronic payment arrangements available for the resulting contract. Community benefits form part of the requirement, with the expected benefits set out in the procurement documents.

The process has reached tender: the University invited offers through an open procedure. It is a single-lot procurement, with bids submitted electronically in English and alternative bids not allowed. Offers had to be submitted by 9 September 2026 at 12:00. The planned contract period is 720 days, with a possible 12-month renewal if maintenance and warranty are required. The buyer may also request additional deliveries for partial replacement, or extensions to existing supplies and installations. Evaluation is based on quality at 60% and price at 40%. Bids must remain valid for 180 days. Suppliers are expected to have average annual turnover of at least £1,200,000 over the previous three years and specified insurance cover.

This opportunity suits manufacturers, authorised suppliers and specialist systems integrators with experience delivering and installing inductively coupled plasma chemical vapour deposition equipment for semiconductor, photonics, power-electronics or comparable laboratory applications. Bidders must provide three examples demonstrating relevant experience in delivering the equipment described in the requirement. The successful supplier must be able to maintain, or commit to obtaining before contract commencement, employer’s liability insurance of £10 million, public and product liability insurance of £10 million, and professional risk indemnity insurance of £2 million. The buyer is seeking a financially established supplier able to protect continuity across its supply chain, provide installation and support, and meet the technical and quality demands of an advanced semiconductor packaging facility.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-06dd11
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/074459-2026
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
6 Aug 20262 weeks ago
Submission Deadline
9 Sep 20262 weeks to go
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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