This public procurement record has 1 release in its history.

Tender

06 Aug 2026 at 10:48

Summary of the contracting process

The University of Strathclyde is buying, supplying, delivering and installing a Matrix Plasma Asher, a specialist laboratory and precision instrument. The equipment will support the National Centre for Advanced Semiconductor Packaging (NCASP), an industry-led facility intended to connect UK device design with domestic semiconductor packaging, testing and metrology. The wider purpose is to strengthen advanced semiconductor manufacturing capability in the UK, reduce reliance on overseas outsourced assembly and test facilities, protect intellectual property and shorten routes from research to volume production. Delivery and installation will take place in Glasgow. This is a goods requirement for a single item, with the successful supplier also supporting the University’s open-access packaging capability and associated community-benefit commitments.

The procurement has reached tender: the buyer invited offers through an open procedure. It is one lot, evaluated on quality at 60% and price at 40%; variants are not allowed. The bid deadline is 9 September 2026 at 12:00, with bids opened and award activity scheduled from that time. The contract is for 720 days, with a possible 12-month renewal if maintenance and warranty are required. The buyer may request additional deliveries for partial replacement or extensions to the supplies and installations. Bidders must show three relevant equipment-delivery examples, average annual turnover of at least £446,000 over the last three years, and the required insurance: £10 million employers’ liability, £10 million public and product liability, and £2 million professional indemnity. English submissions, electronic ordering and electronic payment apply.

This opportunity suits specialist scientific-equipment manufacturers, authorised distributors and systems integrators able to supply, deliver and install a Matrix Plasma Asher for advanced semiconductor packaging work. Strong applicants will be able to demonstrate three comparable examples of delivering the required type of equipment and the technical capability to support installation, warranty and any subsequent maintenance. Suppliers need sufficient financial resilience and access to appropriate commercial insurance, including employers’, public and product liability and professional indemnity cover. The equipment will be used in a technically demanding research and scale-up environment, so relevant experience in semiconductor, photonics, power-electronics, laboratory or precision-engineering applications is likely to be directly useful. The requirement also includes community benefits, making it relevant to businesses able to offer wider local social or economic value.

How relevant is this notice?

Notice Title

Supply, Delivery and Installation of Matrix Plasma Asher

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a Matrix Plasma Asher.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a Matrix Plasma Asher.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-06dd5c
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/074565-2026
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)


CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
6 Aug 20262 weeks ago
Submission Deadline
9 Sep 20262 weeks to go
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland

Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City

Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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