Planning

Provision of Mechanical Testing - pull, push, shear, and bend".

UNIVERSITY OF STRATHCLYDE

This public procurement record has 1 release in its history.

Summary of the contracting process

The University of Strathclyde located in Glasgow, UK, is planning a tender process for the provision of mechanical testing equipment to support its expansion into semiconductor advanced packaging. The planned procurement notice titled "Provision of Mechanical Testing - pull, push, shear, and bend" highlights the University's focus on power electronic semiconductors. The procurement stage is currently in the planning phase, with a future notice date of 1st May 2024. Businesses in the goods category related to power electronics and semiconductor industry would find this opportunity relevant.

The University of Strathclyde is seeking a supplier to deliver and install flexible mechanical testing equipment for power electronic semiconductors. This procurement process aims to support the University's research facility in developing and scaling up advanced packaging capabilities for power electronic semiconductors. With a contract value of £170,000 GBP, this opportunity presents a chance for businesses with expertise in power electronic semiconductor designs and testing equipment to compete. The University's emphasis on the mechanical testing capabilities required signifies a need for suppliers specializing in precision engineering and semiconductor testing services.

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Notice Title

Provision of Mechanical Testing - pull, push, shear, and bend".

Notice Description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support mechanical testing equipment that can perform pull, push, shear, and bend tests along with any and all associated ancillaries required.

Lot Information

Lot 1

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement process will be procuring equipment to support mechanical testing equipment that can perform pull, push, shear, and bend tests along with any and all associated ancillaries required. The University is seeking a supplier to supply, deliver, install, and commission the equipment.

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000760553
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR500529
Current Stage
Planning
All Stages
Planning

Procurement Classification

Notice Type
PCS Notice - Website Prior Information Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Not Specified
Procurement Method Details
Not specified
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

31 - Electrical machinery, apparatus, equipment and consumables; lighting


CPV Codes

31712330 - Semiconductors

Notice Value(s)

Tender Value
£170,000 £100K-£500K
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
8 Mar 20241 years ago
Submission Deadline
Not specified
Future Notice Date
1 May 2024Expired
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Planned
Lots Status
Planned
Awards Status
Not Specified
Contracts Status
Not Specified

Contracting Authority (Buyer)

Main Buyer
UNIVERSITY OF STRATHCLYDE
Contact Name
Natasha Murray
Contact Email
natasha.murray@strath.ac.uk
Contact Phone
+44 7811592949

Buyer Location

Locality
GLASGOW
Postcode
G1 1XQ
Post Town
Glasgow
Country
Scotland

Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City

Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR500529
    Provision of Mechanical Testing - pull, push, shear, and bend". - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support mechanical testing equipment that can perform pull, push, shear, and bend tests along with any and all associated ancillaries required.

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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