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Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

03 Aug 2026 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde is procuring an automatic submicron flip-chip die bonder for its National Centre for Advanced Semiconductor Packaging. The equipment must perform die attachment and flip-chip bonding for photonics packaging applications, supporting domestic scale-up from device design to packaging, testing and metrology. The wider requirement concerns advanced hermetic sealing capability for hermetic packages used in photonic and advanced semiconductor packaging, including seam sealing and projection welding. This is a goods supply requirement covering delivery, installation and commissioning, with associated maintenance and warranty arrangements. Delivery and installation are in Glasgow. The opportunity will suit equipment manufacturers and specialist suppliers of semiconductor, photonics or advanced packaging production systems, particularly those able to provide integrated installation and commissioning.

The process reached tender: the University invited offers through an open procedure, with electronic submission. The bid deadline and public opening were both 4 September 2026 at 12:00 UTC. The contract period is 720 days, with a possible 12-month renewal if maintenance and warranty are required. The authority may also request additional deliveries for partial replacement, extensions or existing installations. Bids must remain valid for 180 days and be submitted in English; variants are not allowed. Evaluation is based on quality at 60% and price at 40%. The procurement has one lot. Electronic payment and ordering are used, and electronic invoicing is allowed. Community benefits form part of the requirement.

This opportunity is suited to suppliers with proven capability in submicron flip-chip die bonding, die attachment, photonics packaging and related semiconductor manufacturing equipment. Competitors should be able to supply, install and commission specialist production equipment and support it through maintenance and warranty services. The buyer requires three examples demonstrating relevant experience in delivering the equipment described in the contract notice. Suppliers must have the financial resilience to support the equipment and supply chain, together with employer’s liability, public and product liability, and professional risk indemnity insurance at the required levels. Firms with established semiconductor or photonics engineering teams, experienced commissioning staff, reliable after-sales support and capacity to deliver an integrated equipment solution are likely to be best placed.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an automatic submicron flip-chip die bonder capable of performing die attachment and flip chip bonding for photonics packaging application.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000838764
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561426
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
3 Aug 20262 months ago
Submission Deadline
4 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561426
    Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Open Contracting Data Standard (OCDS)

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