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Supply, Delivery and Installation of Optical Alignment & Packaging System

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

03 Aug 2026 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde is buying an optical alignment and packaging system for the National Centre for Advanced Semiconductor Packaging. The equipment will support active and passive alignment for photonics packaging applications, helping create a UK-based scale-up capability for semiconductor packaging, testing and metrology. The requirement covers supply, delivery and installation of the system, with additional deliveries potentially used for replacement or extensions. The work will be delivered in Glasgow. This is a goods procurement suited to manufacturers, systems integrators and specialist equipment suppliers working in photonics, semiconductor packaging, optical alignment or related precision engineering. The system is intended for an industry-led facility connecting UK device design with higher-volume domestic packaging and manufacturing capability.

The procurement has reached tender: the University invited offers through an open procedure, with electronic submission. Bids were due by 4 September 2026 at 12:00 UTC, with public bid opening at the same time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The buyer may also request additional deliveries for partial replacement or extensions to the supplies and installations. Offers are evaluated on quality at 60% and price at 40%; variants are not allowed. Bids must remain valid for 180 days. The requirement is covered by the Government Procurement Agreement. The tender requires English-language submissions and includes community benefits.

This opportunity suits suppliers able to design, manufacture, deliver, install and support specialist optical alignment and packaging equipment for photonics applications. Bidders must demonstrate relevant technical capability through three examples of previous experience delivering comparable equipment. The requirement is aimed at established businesses with sufficient financial and operational capacity to protect delivery and supply-chain continuity, including those able to support maintenance and warranty obligations. Suppliers will need to provide or obtain appropriate employer’s liability, public and product liability, and professional risk indemnity insurance at the required levels. The successful business may gain a role in a nationally significant semiconductor packaging facility intended to support UK innovators and reduce reliance on overseas packaging services.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Optical Alignment & Packaging System

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000838767
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561427
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
3 Aug 20262 months ago
Submission Deadline
4 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561427
    Supply, Delivery and Installation of Optical Alignment & Packaging System - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.

Open Contracting Data Standard (OCDS)

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