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Supply, Delivery and Installation of Laser Waveguide Writing Equipment

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

03 Aug 2026 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde is buying laser waveguide writing equipment for photonics packaging applications. The equipment must write waveguides using a laser beam and will support the National Centre for Advanced Semiconductor Packaging, an industry-led scale-up facility intended to connect UK device design with domestic high-volume semiconductor packaging, testing and metrology. This is a supply, delivery and installation requirement for goods, classified under CPV 38000000 (laboratory, optical and precision equipment). Delivery is in Glasgow. The procurement supports development of sovereign, open-access advanced semiconductor packaging capability for UK photonics and power-electronics innovators, helping reduce reliance on overseas semiconductor assembly and test facilities, shorten lead times and protect intellectual property. Community benefits form part of the requirement, with details set out in the procurement documents.

The process reached tender: the University invited offers through an open procedure, with electronic submission in English. The tender deadline and bid opening were both set for 4 September 2026 at 12:00 UTC. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The buyer may also request additional deliveries for partial replacement or extensions to existing supplies and installations. Evaluation is based on quality at 65% and price at 35%; variants are not permitted. Bids must remain valid for 180 days. Electronic ordering and payment will be used, and electronic invoicing is allowed. The procurement is covered by the Government Procurement Agreement and includes community-benefit requirements.

This opportunity suits manufacturers, specialist equipment suppliers and system integrators with proven capability in laser-based waveguide writing for photonics packaging. Suppliers should be able to provide, deliver, install and support precision optical or laboratory equipment, including maintenance and warranty services where required. Applicants must provide three examples demonstrating relevant experience in delivering comparable equipment. The requirement is aimed at businesses able to support an advanced semiconductor-packaging facility and its industry-facing scale-up work, so experience in photonics, semiconductor processing, optical engineering or related precision manufacturing environments will be relevant. Financial and operational capacity is significant: bidders need an average annual turnover of at least £1,576,000 over the previous three years and must hold or obtain employer’s, public and product liability, and professional indemnity insurance at the required levels.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Laser Waveguide Writing Equipment

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for waveguide writing equipment capable of performing waveguide writing using laser beam for photonics packaging applications.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for waveguide writing equipment capable of performing waveguide writing using laser beam for photonics packaging applications.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000838769
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561428
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
3 Aug 20262 months ago
Submission Deadline
4 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561428
    Supply, Delivery and Installation of Laser Waveguide Writing Equipment - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for waveguide writing equipment capable of performing waveguide writing using laser beam for photonics packaging applications.

Open Contracting Data Standard (OCDS)

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