This public procurement record has 1 release in its history.

Tender

05 Aug 2026 at 01:00

Summary of the contracting process

The University of Strathclyde is buying a high-accuracy motion control and imaging system, including its supply, delivery and installation. The equipment will support the National Centre for Advanced Semiconductor Packaging, an industry-led facility intended to connect UK device design with domestic high-volume semiconductor packaging, testing and metrology. The requirement is for goods used in advanced semiconductor manufacturing and research, with the wider aim of reducing reliance on overseas outsourced semiconductor assembly and test facilities, shortening lead times and protecting intellectual property. Delivery is in Glasgow. The procurement is relevant to manufacturers, systems integrators and specialist suppliers of precision motion-control, imaging and semiconductor equipment that can provide and install a complete operational system.

The buyer invited offers through a tender using an open procedure, with electronic submission. Bids had to be submitted by 7 September 2026 at 12:00 UTC; bids were opened at the same time and evaluation was scheduled to begin then. The contract period is 720 days, with a possible further 12-month renewal if maintenance and warranty are required. The buyer may also request additional deliveries for partial replacement or extensions to existing supplies and installations. There is one lot. Evaluation gives quality 60% and price 40%. Bids must remain valid for 180 days and be submitted in English. Electronic payment and ordering are supported, with electronic invoicing allowed.

This opportunity suits suppliers with demonstrated expertise in precision motion-control and imaging systems, particularly where equipment must be integrated, delivered and installed for advanced semiconductor or other high-accuracy technical environments. Bidders must provide three examples showing relevant experience in delivering the required equipment. The buyer is looking for an established organisation with sufficient financial resilience to protect delivery and the supply chain, alongside the ability to maintain employer’s liability, public and product liability, and professional indemnity insurance at the required levels. Suppliers able to provide ongoing maintenance and warranty support, handle replacement or extension equipment, and meet the operational demands of a specialist research and manufacturing facility are well placed to compete.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of High Accuracy Motion Control and Imaging System

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a High Accuracy Motion Control and Imaging System.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a High Accuracy Motion Control and Imaging System.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000839073
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561708
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)


CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
5 Aug 20262 months ago
Submission Deadline
7 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland

Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City

Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561708
    Supply, Delivery and Installation of High Accuracy Motion Control and Imaging System - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a High Accuracy Motion Control and Imaging System.

Open Contracting Data Standard (OCDS)

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