Award

Ask AI about this notice

Summarise, research or assess it with AI

View Markdown

Share this notice

Send this contract to a colleague

Supply of Semiconductor Dicing and Grinding Systems

Swansea University

This public procurement record has 2 releases in its history.

Award

08 Nov 2021 at 15:35

Award Notice
Tender

23 Jul 2021 at 09:05

Tender Notice
Summary of the contracting process

The procurement process involves Swansea University seeking tenders for the supply and installation of Semiconductor Dicing and Grinding Systems. This tender falls under the industry category of laboratory, optical and precision equipment, with a total estimated value of £350,000. The procurement is currently in the active tender stage with a submission deadline set for 24th August 2021. Deliveries are to be made to either the Swansea University Bay Campus or Newport Wafer Fab in Wales, United Kingdom, with an emphasis on reliable equipment to support extensive experimental work at the facility.

This tender presents significant opportunities for growth within the semiconductor manufacturing sector, particularly for businesses involved in the supply of high-precision laboratory equipment. Companies with capabilities in producing or installing wafer dicing and grinding systems would be particularly well-suited to compete for this contract. Additionally, firms that can ensure the reliability and quality of their equipment, in order to support critical research and experimental initiatives, will find valuable prospects in this procurement process.

How relevant is this notice?

Notice Information

Notice Title

Supply of Semiconductor Dicing and Grinding Systems

Notice Description

This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. This requirement is split into two separate lots

Lot Information

Wafer Dicing System

This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Additional information: Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.

Wafer Grinding System

This procurement is for the supply and installation of a Wafer Grinding System. This will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Additional information: Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-02cb8f
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/027974-2021
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Large

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£350,000 £100K-£500K
Lots Value
£330,000 £100K-£500K
Awards Value
Not specified
Contracts Value
£382,574 £100K-£500K

Notice Dates

Publication Date
8 Nov 20214 years ago
Submission Deadline
24 Aug 2021Expired
Future Notice Date
Not specified
Award Date
19 Oct 20214 years ago
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Cancelled
Awards Status
Active
Contracts Status
Active

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
Swansea University
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
SWANSEA
Postcode
SA2 8PP
Postcode Area
Swansea
Country
Wales
Major Region (ITL 1)
TLL Wales
Basic Region (ITL 2)
TLL4 Mid and South West Wales
Small Region (ITL 3)
TLL43 Swansea
Delivery Location
TLL17 Bridgend and Neath Port Talbot, TLL18 Swansea, TLL21 Monmouthshire and Newport
Local Authority
Swansea
Electoral Ward
Sketty
Westminster Constituency
Swansea West

Supplier Information

Number of Suppliers
1
Supplier Name

Disco HI-TEC UK LTD

Further Information

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

JSON Markdown

The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

Loading OCDS record...