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Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

03 Aug 2026 at 10:18

Tender Notice
Summary of the contracting process

The University of Strathclyde is procuring the supply, delivery, installation and commissioning of an automatic submicron flip-chip die bonder. The equipment must perform die attachment and flip-chip bonding for photonics packaging applications within the National Centre for Advanced Semiconductor Packaging. The requirement supports an integrated UK scale-up facility linking device design with domestic packaging, testing and metrology. It falls within laboratory, optical and precision equipment. The equipment will be delivered and installed in Glasgow. The requirement is intended for suppliers able to provide a complete specialist equipment solution, including commissioning and support for advanced semiconductor packaging operations. Community benefits form part of the requirement, with the expected benefits described in the procurement documents.

This procurement has reached tender: the University of Strathclyde invited offers through an open procedure. Bids were to be submitted electronically by 4 September 2026 at 12:00 UK time. The planned contract period is 720 days, with a possible 12-month renewal for required maintenance and warranty. The authority may also request additional deliveries to replace or extend supplies and installations. Evaluation is based on quality, weighted 60%, and price, weighted 40%. Bidders must demonstrate an average annual turnover of at least £2,384,000 over the previous three years, hold or obtain specified insurance, and provide three examples of relevant equipment-delivery experience. Bids must remain valid for 180 days.

This opportunity suits manufacturers, authorised equipment suppliers and specialist integrators of semiconductor or photonics packaging machinery. Competitors need the technical capability to supply, install and commission an automatic submicron flip-chip die bonder and demonstrate experience delivering comparable equipment. The requirement is relevant to businesses serving advanced semiconductor, photonics, microelectronics or precision laboratory environments, particularly those able to support die attachment and flip-chip bonding processes. Suppliers must be financially established enough to meet the turnover requirement and able to maintain substantial employer’s, public and product liability, and professional indemnity insurance. The work also suits firms with the capacity to provide maintenance, warranty support and potential replacement or extension equipment, alongside the stated community-benefit commitments.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an automatic submicron flip-chip die bonder capable of performing die attachment and flip chip bonding for photonics packaging application.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-06d9a5
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/073039-2026
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
3 Aug 20262 months ago
Submission Deadline
4 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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