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Supply, Delivery and Installation of Wafer-Level Optical Tester

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

05 Aug 2026 at 10:15

Tender Notice
Summary of the contracting process

The University of Strathclyde is buying wafer-level optical tester equipment for the National Centre for Advanced Semiconductor Packaging. The equipment must characterise surface-emitting Distributed Feedback (DFB) laser arrays and silicon photonic integrated circuits (PICs). It will support an integrated, industry-led scale-up facility intended to connect UK device design with domestic packaging, testing and metrology, helping photonics and power-electronics innovators move towards higher-volume manufacture. This is a goods requirement for laboratory, optical and precision equipment. The supply includes delivery and installation, with the work taking place in Glasgow. The requirement forms part of a wider effort to develop sovereign, open-access advanced semiconductor packaging capability in the UK and reduce dependence on overseas semiconductor assembly and testing facilities. Community benefits are included in the requirement.

The procurement has reached tender: the University invited offers through a single-lot open procedure. The estimated value is £788,000. Bids must be submitted electronically in English by 7 September 2026 at 12:00. The contract is for 720 days, with a possible 12-month renewal where maintenance and warranty are required. The buyer may also request additional deliveries for partial replacement, or extensions to existing supplies and installations. Bids must remain valid for 180 days. Evaluation is based on quality, weighted at 60%, and price, weighted at 40%. The procurement uses electronic ordering and electronic payment, with electronic invoicing permitted. Variants are not allowed. The procedure is covered by the Government Procurement Agreement.

This opportunity suits manufacturers, specialist distributors and systems integrators with proven experience supplying and installing wafer-level optical testing equipment for semiconductor, photonics or closely related applications. Bidders must provide three examples demonstrating relevant experience in delivering the required equipment. Suppliers must have an average annual turnover of at least £1,576,000 over the previous three years, indicating that the buyer is seeking an established business able to support the supply chain. Contractors must hold, or commit to obtaining before contract commencement, employer’s liability insurance of £10 million, public and product liability insurance of £10 million, and professional indemnity insurance of £2 million. Relevant capability includes characterising DFB laser arrays and silicon photonic integrated circuits, installation, maintenance and warranty support. Community-benefit commitments also apply.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Wafer-Level Optical Tester

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for wafer-level optical tester(s) capable of performing characterization of both surface-emitting Distributed Feedback (DFB) laser arrays and silicon photonic integrated circuits (PICs).

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for wafer-level optical tester(s) capable of performing characterization of both surface-emitting Distributed Feedback (DFB) laser arrays and silicon photonic integrated circuits (PICs).

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-h6vhtk-06dbfb
Publication Source
Find A Tender Service
Latest Notice
https://www.find-tender.service.gov.uk/Notice/074011-2026
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£788,000 £500K-£1M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
5 Aug 20262 months ago
Submission Deadline
7 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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