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Supply, Delivery and Installation of Sinter Bonding Capability

University of Strathclyde

This public procurement record has 2 releases in its history.

Award

13 May 2026 at 01:00

OJEU - F3 - Contract Award Notice
Tender

17 Dec 2025 at 00:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde, based in Glasgow, has successfully awarded a contract for the "Supply, Delivery and Installation of Sinter Bonding Capability" under an open procurement procedure. This purchase is part of the expansion of the National Manufacturing Institute Scotland's (NMIS) capabilities in semiconductor advanced packaging, specifically targeting power electronic semiconductors. The contract was awarded to Inseto UK Limited on 23 March 2026, with a contract value of £819,990. This procurement process covered goods within the education sector and is classified under CPV code 38000000. The process moved from tendering, initiated in December 2025 with submissions closing by 26 January 2026, to a completed award stage.

This tender offers business growth opportunities for firms involved in supply and installation of semiconductors and related technologies, especially those specialised in innovative and flexible equipment design that can support a range of semiconductor packaging requirements. Companies that have a background in R&D and medium volume production in the semiconductor industry would find this contract appealing. The procurement emphasised versatility, requiring features such as automated handling and capabilities to operate under inert atmospheres, providing an ideal platform for businesses to showcase their technical expertise and innovative solutions in semiconductor processing. SMEs particularly benefited, as indicated by the successful bid from Inseto UK Limited, aligning with the University of Strathclyde's interest in supporting smaller, agile suppliers in the market.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Sinter Bonding Capability

Notice Description

National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

Lot Information

Lot 1

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement activity is to acquire a sinter bonding press that is versatile to support both R&D activities and medium volume production. In the R&D context we require a capability that allows flexible exploration of tooling to achieve different package arrangements, while keeping tool costs at a minimum. In the medium scale production context we require a capability that includes automated handling solutions such that it can be fed by a magazine unstacker, and can feed a magazine stacker. In either context we require the ability to form bonds under inert atmosphere or forming gas, control the pre-heating and post-cooling ramp profile of sinter bonded assemblies and collect detailed sensor-driven time-histories of temperature and pressure for each bonding operation.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000818603
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY555762
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
OJEU - F3 - Contract Award Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
SME

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£900,000 £500K-£1M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
£819,990 £500K-£1M

Notice Dates

Publication Date
13 May 20263 months ago
Submission Deadline
26 Jan 2026Expired
Future Notice Date
Not specified
Award Date
23 Mar 20265 months ago
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Complete
Awards Status
Not Specified
Contracts Status
Active

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Supplier Information

Number of Suppliers
1
Supplier Name

Inseto UK Limited

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=DEC545904
    Supply, Delivery and Installation of Sinter Bonding Capability - National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY555762
    Supply, Delivery and Installation of Sinter Bonding Capability - National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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