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Supply, Delivery and Installation of Solder Jetting Equipment

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

30 Jul 2026 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde is procuring the supply, delivery and installation of solder jetting equipment for the National Centre for Advanced Semiconductor Packaging. The equipment will process photonic and semiconductor devices so they can be integrated into advanced packages, supporting a UK-based scale-up facility for semiconductor packaging, testing and metrology. This is a goods requirement, classified under CPV 38000000 (laboratory, optical and precision equipment). Delivery is in Glasgow. The requirement forms part of a wider effort to provide domestic, open-access advanced packaging capability for photonics and power electronics innovators, reducing reliance on overseas facilities and supporting the transition from research to manufacturable products.

The process reached tender: the University invited offers through an open procedure, with electronic submission in English. The tender deadline was 31 August 2026 at 12:00 UTC, when bids were also scheduled to open; the evaluation period began at that time. The contract is for 720 days, with a possible 12-month renewal where maintenance and warranty are required. The buyer may also request additional deliveries for partial replacement or extensions to the equipment and installations. Bids must remain valid for 180 days. Evaluation is based on quality at 60% and price at 40%. Electronic ordering and payment are supported, and electronic invoicing is allowed. Community benefits are included.

This opportunity suits manufacturers, specialist distributors and systems integrators with demonstrable experience supplying and installing solder jetting equipment for photonic or semiconductor applications. Bidders must provide three examples of relevant previous work, showing that they can deliver the specified equipment and manage its installation. The requirement is suited to suppliers with sufficient financial and operational capacity to support a technically demanding, research-led packaging facility and its supply chain. Applicants need an average annual turnover of at least £1,184,000 over the previous three years. They must also be able to maintain or obtain employer’s liability, public and product liability, and professional risk indemnity insurance at the required levels before contract commencement.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Solder Jetting Equipment

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000838017
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561200
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
30 Jul 20262 months ago
Submission Deadline
31 Aug 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561200
    Supply, Delivery and Installation of Solder Jetting Equipment - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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