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Supply, Delivery and Installation of Hermetic Sealing Kit

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

30 Jul 2026 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde is seeking an advanced hermetic sealing kit for the National Centre for Advanced Semiconductor Packaging. The requirement covers the supply, delivery and installation of equipment providing seam sealing and projection welding for hermetic packages used in photonic and advanced semiconductor packaging. It supports a domestic, high-volume packaging, testing and metrology capability for UK device designers and innovators, reducing reliance on overseas outsourced semiconductor assembly and test facilities. This is a goods procurement in the industrial, scientific and technical equipment category (CPV 38000000). The equipment and associated installation are intended for delivery and use in Glasgow, where the University is based.

The procurement has reached tender: the University invited offers through an open procedure, with electronic submission. The tender deadline and bid opening were set for 1 September 2026 at 12:00 UTC. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The University may also request additional deliveries for partial replacement, or extensions to existing supplies and installations. Bids must remain valid for 180 days and be submitted in English; variants are not permitted. Evaluation is split equally between quality and price, each carrying 50%. Electronic ordering and payment are supported, and electronic invoicing is allowed.

This opportunity suits manufacturers, suppliers and specialist integrators of hermetic sealing equipment for semiconductor, photonics or other advanced packaging applications. Competitors should be able to supply, install and support equipment capable of seam sealing and projection welding, with relevant technical expertise and a demonstrable record of delivery. The buyer requires three examples of comparable previous experience, so established suppliers with proven installations are well placed. Financial capacity is significant: bidders need average annual turnover of at least £1,072,000 over the last three years. They must also hold or obtain employer’s liability and public and product liability insurance of £10 million each, plus £2 million professional indemnity cover.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Hermetic Sealing Kit

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000838736
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561290
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
30 Jul 20262 months ago
Submission Deadline
1 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561290
    Supply, Delivery and Installation of Hermetic Sealing Kit - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Open Contracting Data Standard (OCDS)

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