This public procurement record has 1 release in its history.

Tender

31 Jul 2026 at 00:00

Summary of the contracting process

The University of Strathclyde, a leading educational institution in Glasgow, is actively seeking tenders for the supply, delivery, installation, and commissioning of a die inspection sorter to enhance photonics packaging applications. This procurement falls under the education industry category and targets advancements in semiconductor packaging capabilities within the UK. The procurement stage is currently tendering, with the tender period ending on 1st September 2026 at noon. This open procedure will be conducted electronically, and submissions in English are required. The contract value is estimated at £1,160,000 with payment and ordering being managed electronically. The procurement aligns with initiatives of the National Centre for Advanced Semiconductor Packaging (NCASP) to bolster domestic technology scale-up facilities.

This tender presents significant opportunities for businesses involved in semiconductor technologies, particularly those specialising in automated inspection systems and photonic applications. Companies with substantial turnover, robust insurance cover, and a proven track record are well-positioned to compete successfully. By participating, businesses can contribute to a strategic national effort, potentially leading to further opportunities in the evolving landscape of advanced manufacturing technologies in the UK. Engaging in this procurement could enhance a company's market presence, establish long-term partnerships, and catalyse innovation aligned with national industry goals.

How relevant is this notice?

Notice Title

Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000838765
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561408
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)


CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£1,160,000 £1M-£10M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
31 Jul 20266 days ago
Submission Deadline
1 Sep 20264 weeks to go
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Contracting Authority (Buyer)

Main Buyer
UNIVERSITY OF STRATHCLYDE
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Post Town
Glasgow
Country
Scotland

Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City

Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561408
    Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

{
    "tag": [
        "compiled"
    ],
    "id": "ocds-r6ebe6-0000838765-2026-07-31T00:00:00Z",
    "date": "2026-07-31T00:00:00Z",
    "ocid": "ocds-r6ebe6-0000838765",
    "initiationType": "tender",
    "parties": [
        {
            "id": "org-1",
            "name": "University of Strathclyde",
            "identifier": {
                "legalName": "University of Strathclyde"
            },
            "address": {
                "streetAddress": "Learning & Teaching Building, 49 Richmond Street",
                "locality": "Glasgow",
                "region": "UKM82",
                "postalCode": "G1 1XU"
            },
            "contactPoint": {
                "name": "Anna Sanina",
                "email": "anna.sanina@strath.ac.uk",
                "telephone": "+44 7811592949",
                "url": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html"
            },
            "roles": [
                "buyer",
                "centralPurchasingBody"
            ],
            "details": {
                "classifications": [
                    {
                        "id": "Body governed by public law",
                        "scheme": "TED_CA_TYPE"
                    },
                    {
                        "id": "09",
                        "description": "Education",
                        "scheme": "COFOG"
                    }
                ],
                "url": "http://www.strath.ac.uk/"
            }
        },
        {
            "id": "org-2",
            "name": "Glasgow Sheriff Court",
            "identifier": {
                "legalName": "Glasgow Sheriff Court"
            },
            "address": {
                "streetAddress": "1 Carlton Place",
                "locality": "Glasgow",
                "postalCode": "G5 9TW"
            },
            "contactPoint": {
                "url": "http://"
            },
            "roles": [
                "reviewBody"
            ]
        }
    ],
    "buyer": {
        "name": "University of Strathclyde",
        "id": "org-1"
    },
    "tender": {
        "id": "UOS-43644-2026",
        "title": "Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter",
        "description": "Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.",
        "status": "active",
        "items": [
            {
                "id": "1",
                "deliveryAddresses": [
                    {
                        "region": "UKM82"
                    }
                ],
                "relatedLot": "1"
            }
        ],
        "value": {
            "amount": 1160000,
            "currency": "GBP"
        },
        "procurementMethod": "open",
        "procurementMethodDetails": "Open procedure",
        "mainProcurementCategory": "goods",
        "submissionMethod": [
            "electronicSubmission"
        ],
        "submissionMethodDetails": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html",
        "tenderPeriod": {
            "endDate": "2026-09-01T12:00:00Z"
        },
        "awardPeriod": {
            "startDate": "2026-09-01T12:00:00Z"
        },
        "documents": [
            {
                "id": "JUL561408",
                "documentType": "contractNotice",
                "title": "Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter",
                "description": "Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.",
                "url": "https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561408",
                "format": "text/html"
            }
        ],
        "lots": [
            {
                "id": "1",
                "description": "Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.",
                "status": "active",
                "awardCriteria": {
                    "criteria": [
                        {
                            "type": "quality",
                            "name": "Quality",
                            "description": "50"
                        },
                        {
                            "type": "price",
                            "description": "50"
                        }
                    ]
                },
                "options": {
                    "description": "The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option."
                },
                "hasOptions": true,
                "submissionTerms": {
                    "variantPolicy": "notAllowed"
                },
                "contractPeriod": {
                    "durationInDays": 720
                },
                "hasRenewal": true,
                "renewal": {
                    "description": "12 months (if required maintenance and warranty)"
                }
            }
        ],
        "bidOpening": {
            "date": "2026-09-01T12:00:00Z"
        },
        "contractTerms": {
            "hasElectronicPayment": true,
            "hasElectronicOrdering": true,
            "electronicInvoicingPolicy": "allowed"
        },
        "coveredBy": [
            "GPA"
        ],
        "selectionCriteria": {
            "criteria": [
                {
                    "type": "economic",
                    "description": "4B 1.2 Turnover Bidders will be required to have an average yearly turnover of a minimum of 2,320,000 GBP for the last 3 (three) years, to ensure the University is protected from any unforeseen financial risks that may impact the supplier or supply chain.",
                    "minimum": "4B.5.1- 4B5.3 Insurances Insurance requirements are in line with levels identified in the UOS standard Terms and Conditions. It is a requirement of this contract that bidders can hold or commit to obtain prior to the commencement of any subsequently awarded contract, the types of insurance indicated below: The Contractor shall maintain in force with reputable insurers Employer's (Compulsory) Liability Insurance = GBP10m Public and Product Liability Insurance = GBP10m Professional Risk Indemnity Insurance = GBP2m In respect of any one incident and unlimited as to numbers of claims"
                },
                {
                    "type": "technical",
                    "description": "4C.1.2 Previous Experience Bidders will be required to provide three (3) examples that demonstrate that they have the relevant experience to deliver the equipment as stated in the Contract Notice."
                }
            ]
        },
        "submissionTerms": {
            "languages": [
                "en"
            ],
            "bidValidityPeriod": {
                "durationInDays": 180
            }
        },
        "classification": {
            "id": "38000000",
            "scheme": "CPV"
        },
        "hasRecurrence": false,
        "legalBasis": {
            "id": "32014L0024",
            "scheme": "CELEX"
        }
    },
    "language": "EN",
    "description": "The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 32462. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 Community benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/ A summary of the expected community benefits has been provided as follows: Please see Procurement documents for full details (SC Ref:818603) The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 32462. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 Community benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/ A summary of the expected community benefits has been provided as follows: Please see Procurement documents for full details (SC Ref:838765)",
    "links": [
        {
            "rel": "canonical",
            "href": "https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000838765"
        }
    ],
    "noticetype": "OJEU - F2 - Contract Notice"
}