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Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

31 Jul 2026 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde is buying an automatic die inspection sorter, including its supply, delivery, installation and commissioning, for photonics packaging applications. The equipment will support the National Centre for Advanced Semiconductor Packaging (NCASP), an industry-led scale-up facility intended to connect UK device design with domestic high-volume semiconductor packaging, testing and metrology. The requirement is for goods in the specialist industrial and scientific equipment category (CPV 38000000). Delivery and the associated work will take place in Glasgow. The equipment is intended to help develop domestic semiconductor packaging capability and support the inspection and sorting of dies used in photonics packaging.

The process reached tender: the University of Strathclyde invited offers through an open procedure, with electronic submission. The bid deadline and public opening were set for 1 September 2026 at 12:00 UTC. The estimated procurement value is £1,160,000. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The buyer may also request additional deliveries for partial replacement or extensions to existing supplies and installations. Bids must be in English and remain valid for 180 days. Award is based equally on quality and price, each carrying 50% of the assessment.

This opportunity suits specialist suppliers of semiconductor, photonics or advanced manufacturing inspection equipment that can provide an automatic die inspection sorter and take responsibility for delivery, installation and commissioning. Suppliers should be able to demonstrate relevant technical experience through three comparable equipment-delivery examples and support the equipment through appropriate maintenance and warranty arrangements. The requirement is suited to businesses with established supply-chain resilience and the capacity to deliver a technically demanding system for a national-scale packaging facility. Bidders must be able to maintain or obtain substantial employer’s, public and product liability, and professional indemnity insurance. Community benefits are also part of the requirement, so suppliers should be prepared to address those commitments.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000838765
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561408
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£1,160,000 £1M-£10M
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
31 Jul 20262 months ago
Submission Deadline
1 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561408
    Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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