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Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

03 Aug 2026 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde is buying an automated laser chip burn-in tester, including its supply, delivery and installation. The equipment will perform burn-in testing as part of the National Centre for Advanced Semiconductor Packaging (NCASP), an industry-led facility intended to support domestic semiconductor packaging, testing and metrology. This is a specialist semiconductor test and laboratory equipment supply opportunity, classified under CPV 38000000 for laboratory, optical and precision equipment. Delivery is in Glasgow. The requirement supports UK photonics and power-electronics businesses by providing access to domestic high-volume packaging and testing capability, reducing reliance on overseas outsourced semiconductor assembly and test facilities. The contract includes associated equipment installation and maintenance or warranty support where applicable, and community benefits form part of the requirement.

The process has reached tender: the University of Strathclyde invited offers through an open procedure, with electronic submission in English. The bid deadline and bid opening were set for 7 September 2026 at 12:00 UTC. The contract period is 720 days, with a possible 12-month renewal where required for maintenance and warranty. The buyer may also request additional deliveries for partial replacement or extensions to existing supplies and installations. Evaluation is based on quality at 60% and price at 40%; variants are not allowed. Bids must remain valid for 180 days. Electronic ordering and payment apply, and electronic invoicing is allowed. The procurement is covered by the Government Procurement Agreement.

This opportunity suits established suppliers of automated semiconductor, laser, photonic or precision test equipment that can design, supply, install and support burn-in testing systems. Bidders must provide three examples demonstrating relevant experience delivering the required equipment, so a proven track record in comparable specialist installations is important. Financial capacity is material: the required average annual turnover is at least £1.3 million over the last three years. Suppliers must hold, or commit to obtain before contract start, employer’s liability insurance of £10 million, public and product liability insurance of £10 million, and professional indemnity insurance of £2 million. The scale and technical nature favour suppliers able to manage equipment delivery, commissioning, warranty and maintenance support.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000838770
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561507
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
3 Aug 20262 months ago
Submission Deadline
7 Sep 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561507
    Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing.

Open Contracting Data Standard (OCDS)

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