Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit

Notice Information

Get alerts for notices like these

Notice Title

Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Get alerts for notices like these

Publication & Lifecycle

Open Contracting ID: ocds-r6ebe6-0000839011
Publication Source: Public Contracts Scotland
Latest Notice: https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561392
Current Stage: Tender
All Stages: Tender

Procurement Classification

Notice Type: PCS Notice - Website Contract Notice
Procurement Type: Standard
Procurement Category: Goods
Procurement Method: Open
Procurement Method Details: Open procedure
Tender Suitability: Not specified
Awardee Scale: Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions: 38 - Laboratory, optical and precision equipments (excl. glasses)
CPV Codes: 38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value: Not specified
Lots Value: Not specified
Awards Value: Not specified
Contracts Value: Not specified

Notice Dates

Publication Date: 31 Jul 20266 days ago
Submission Deadline: 17 Aug 20262 weeks to go
Future Notice Date: Not specified
Award Date: Not specified
Contract Period: Not specified - Not specified
Recurrence: Not specified

Notice Status

Tender Status: Active
Lots Status: Active
Awards Status: Not Specified
Contracts Status: Not Specified

Buyer & Supplier

Get alerts for notices like these

Contracting Authority (Buyer)

Main Buyer: UNIVERSITY OF STRATHCLYDE
Contact Name: Available with D3 Tenders Premium →
Contact Email: Available with D3 Tenders Premium →
Contact Phone: Available with D3 Tenders Premium →

Buyer Location

Locality: GLASGOW
Postcode: G1 1XU
Post Town: Glasgow
Country: Scotland
Major Region (ITL 1): TLM Scotland
Basic Region (ITL 2): TLM3 West Central Scotland
Small Region (ITL 3): TLM32 Glasgow City
Delivery Location: TLM82 Glasgow City
Local Authority: Glasgow City
Electoral Ward: Anderston/City/Yorkhill
Westminster Constituency: Glasgow North East

Further Information

Notice Documents

https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561392
Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.

Notice URLs

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

JSON Markdown

The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

{
    "tag": [
        "compiled"
    ],
    "id": "ocds-r6ebe6-0000839011-2026-07-31T00:00:00Z",
    "date": "2026-07-31T00:00:00Z",
    "ocid": "ocds-r6ebe6-0000839011",
    "initiationType": "tender",
    "parties": [
        {
            "id": "org-7",
            "name": "University of Strathclyde",
            "identifier": {
                "legalName": "University of Strathclyde"
            },
            "address": {
                "streetAddress": "Learning & Teaching Building, 49 Richmond Street",
                "locality": "Glasgow",
                "region": "UKM82",
                "postalCode": "G1 1XU"
            },
            "contactPoint": {
                "name": "Anna Sanina",
                "email": "anna.sanina@strath.ac.uk",
                "url": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html"
            },
            "roles": [
                "buyer",
                "centralPurchasingBody"
            ],
            "details": {
                "classifications": [
                    {
                        "id": "Body governed by public law",
                        "scheme": "TED_CA_TYPE"
                    },
                    {
                        "id": "09",
                        "description": "Education",
                        "scheme": "COFOG"
                    }
                ],
                "url": "http://www.strath.ac.uk/"
            }
        },
        {
            "id": "org-8",
            "name": "Glasgow Sheriff Court",
            "identifier": {
                "legalName": "Glasgow Sheriff Court"
            },
            "address": {
                "streetAddress": "1 Carlton Place",
                "locality": "Glasgow",
                "postalCode": "G5 9TW"
            },
            "contactPoint": {
                "url": "http://"
            },
            "roles": [
                "reviewBody"
            ]
        }
    ],
    "buyer": {
        "name": "University of Strathclyde",
        "id": "org-7"
    },
    "tender": {
        "id": "UOS-43492-2025",
        "title": "Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit",
        "description": "Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6\", 8\" and 12\" thin wafers that are required for photonics.",
        "status": "active",
        "items": [
            {
                "id": "1",
                "deliveryAddresses": [
                    {
                        "region": "UKM82"
                    }
                ],
                "relatedLot": "1"
            }
        ],
        "procurementMethod": "open",
        "procurementMethodDetails": "Open procedure",
        "mainProcurementCategory": "goods",
        "submissionMethod": [
            "electronicSubmission"
        ],
        "submissionMethodDetails": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html",
        "tenderPeriod": {
            "endDate": "2026-08-17T12:00:00Z"
        },
        "awardPeriod": {
            "startDate": "2026-08-17T12:00:00Z"
        },
        "documents": [
            {
                "id": "JUL561392",
                "documentType": "contractNotice",
                "title": "Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit",
                "description": "Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6\", 8\" and 12\" thin wafers that are required for photonics.",
                "url": "https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561392",
                "format": "text/html"
            }
        ],
        "lots": [
            {
                "id": "1",
                "description": "Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6\", 8\" and 12\" thin wafers that are required for photonics.",
                "status": "active",
                "options": {
                    "description": "The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option."
                },
                "hasOptions": true,
                "submissionTerms": {
                    "variantPolicy": "notAllowed"
                },
                "contractPeriod": {
                    "durationInDays": 720
                },
                "hasRenewal": true,
                "renewal": {
                    "description": "12 months (if required maintenance and warranty)"
                }
            }
        ],
        "bidOpening": {
            "date": "2026-08-17T12:00:00Z"
        },
        "contractTerms": {
            "hasElectronicPayment": true,
            "hasElectronicOrdering": true,
            "electronicInvoicingPolicy": "allowed"
        },
        "coveredBy": [
            "GPA"
        ],
        "selectionCriteria": {
            "criteria": [
                {
                    "type": "economic",
                    "description": "4B 1.2 Turnover Bidders will be required to have an average yearly turnover of a minimum of 292,000 GBP for the last 3 (three) years, to ensure the University is protected from any unforeseen financial risks that may impact the supplier or supply chain.",
                    "minimum": "4B.5.1- 4B5.3 Insurances Insurance requirements are in line with levels identified in the UOS standard Terms and Conditions. It is a requirement of this contract that bidders can hold or commit to obtain prior to the commencement of any subsequently awarded contract, the types of insurance indicated below: The Contractor shall maintain in force with reputable insurers Employer's (Compulsory) Liability Insurance = GBP10m Public and Product Liability Insurance = GBP10m Professional Risk Indemnity Insurance = GBP2m In respect of any one incident and unlimited as to numbers of claims"
                },
                {
                    "type": "technical",
                    "description": "4C.1.2 Previous Experience Bidders will be required to provide three (3) examples that demonstrate that they have the relevant experience to deliver the equipment as stated in the Contract Notice."
                }
            ]
        },
        "submissionTerms": {
            "languages": [
                "en"
            ],
            "bidValidityPeriod": {
                "durationInDays": 180
            }
        },
        "classification": {
            "id": "38000000",
            "scheme": "CPV"
        },
        "hasRecurrence": false
    },
    "language": "EN",
    "description": "The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 32461. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 Community benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/ A summary of the expected community benefits has been provided as follows: Please see Procurement documents for full details (SC Ref:818603) The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 32461. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 (SC Ref:839011)",
    "links": [
        {
            "rel": "canonical",
            "href": "https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000839011"
        }
    ],
    "noticetype": "PCS Notice - Website Contract Notice"
}