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Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

31 Jul 2026 at 01:00

PCS Notice - Website Contract Notice
Summary of the contracting process

The University of Strathclyde is procuring an advanced backgrind tape laminator and de-taping turnkey platform, including supply, delivery and installation. The equipment will laminate and de-tape thin six-inch, eight-inch and twelve-inch wafers used in photonics. It supports the National Centre for Advanced Semiconductor Packaging, an industry-led facility intended to connect UK device design with domestic high-volume semiconductor packaging, testing and metrology. The requirement is for goods and associated installation, rather than a standalone consultancy or routine maintenance service. Delivery is in Glasgow. The equipment is classified under CPV 38000000, covering laboratory, optical and precision equipment. The university is acting as the buying organisation for this advanced manufacturing and semiconductor packaging capability.

The procurement reached tender: the university invited offers through a single-lot open procedure, with electronic submission. The tender deadline was 17 August 2026 at 12:00 UTC, with bid opening at the same time. The planned contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The buyer may also request additional deliveries for partial replacement or extensions to existing supplies and installations. Bids must be submitted in English and remain valid for 180 days. Evaluation requires three examples of relevant previous experience. Bidders must demonstrate average annual turnover of at least GBP 292,000 over the last three years and meet insurance requirements of GBP 10 million employers’ liability, GBP 10 million public and product liability, and GBP 2 million professional indemnity cover.

This opportunity suits specialist semiconductor, wafer-processing and precision equipment manufacturers, systems integrators and authorised suppliers able to provide a complete laminating and de-taping platform with delivery and installation. Suitable businesses will understand thin-wafer handling across six-inch, eight-inch and twelve-inch formats, and the process requirements of photonics or advanced semiconductor packaging environments. The requirement favours established suppliers able to evidence three comparable equipment delivery projects and demonstrate financial resilience. Contractors must be able to maintain substantial employers’, public and product liability, and professional indemnity insurance. Capability for ongoing maintenance and warranty support will be relevant because renewal may be required. Suppliers should also be prepared to support community-benefit commitments associated with the university’s procurement.

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Notice Information

Notice Title

Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000839011
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561392
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
PCS Notice - Website Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
31 Jul 20262 months ago
Submission Deadline
17 Aug 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561392
    Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.

Open Contracting Data Standard (OCDS)

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