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Supply, Delivery and Installation of Leak Testing Kit

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

04 Aug 2026 at 01:00

PCS Notice - Website Contract Notice
Summary of the contracting process

The University of Strathclyde is procuring the supply, delivery and installation of a leak-testing kit for hermetic packages used in photonic and advanced semiconductor packaging. The equipment will support the National Centre for Advanced Semiconductor Packaging, an industry-led scale-up facility intended to connect UK device design with domestic high-volume packaging, testing and metrology. The requirement is for goods, with associated installation, and may include maintenance and warranty support. Delivery is in Glasgow. The wider purpose is to provide leak-testing capability for advanced semiconductor packaging and help reduce reliance on overseas outsourced semiconductor assembly and testing facilities. This opportunity will suit equipment manufacturers, specialist semiconductor test suppliers and integrators able to provide and install relevant leak-testing systems.

The procurement reached tender: the University invited offers using an open procedure with electronic submission. The deadline for tenders was 18 August 2026 at 12:00 UTC, with bid opening at the same time. The planned contract period is 720 days, with a possible 12-month renewal where maintenance and warranty support is required. The authority may also request additional deliveries for partial replacement, or extensions to existing supplies and installations. Bids must be submitted in English and remain valid for 180 days after the deadline. Evaluation includes economic and technical selection requirements. Bidders need an average annual turnover of at least GBP 304,000 over the previous three years and must provide three relevant delivery examples.

This opportunity is suited to suppliers with established capability in leak testing for hermetic semiconductor or photonic packages, including firms that can manage equipment supply, delivery, installation and subsequent maintenance or warranty work. Applicants should be able to demonstrate three comparable examples showing relevant experience in delivering the required equipment. The buyer is seeking financially robust suppliers able to protect continuity of supply and support a specialist advanced-packaging facility. Successful bidders must hold, or commit to obtain before contract commencement, employer’s liability insurance of GBP 10 million, public and product liability insurance of GBP 10 million, and professional risk indemnity insurance of GBP 2 million. Community benefits form part of the requirement, with details set out in the procurement documents.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Leak Testing Kit

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Leak Testing capability is required for hermetic packages used in photonic and advanced semiconductor packaging.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Leak Testing capability is required for hermetic packages used in photonic and advanced semiconductor packaging.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000839068
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561520
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
PCS Notice - Website Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
4 Aug 20262 months ago
Submission Deadline
18 Aug 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561520
    Supply, Delivery and Installation of Leak Testing Kit - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Leak Testing capability is required for hermetic packages used in photonic and advanced semiconductor packaging.

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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