Supply, Delivery and Installation of Leak Testing Kit

Notice Information

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Notice Title

Supply, Delivery and Installation of Leak Testing Kit

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Leak Testing capability is required for hermetic packages used in photonic and advanced semiconductor packaging.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Leak Testing capability is required for hermetic packages used in photonic and advanced semiconductor packaging.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

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Publication & Lifecycle

Open Contracting ID: ocds-r6ebe6-0000839068
Publication Source: Public Contracts Scotland
Latest Notice: https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561520
Current Stage: Tender
All Stages: Tender

Procurement Classification

Notice Type: PCS Notice - Website Contract Notice
Procurement Type: Standard
Procurement Category: Goods
Procurement Method: Open
Procurement Method Details: Open procedure
Tender Suitability: Not specified
Awardee Scale: Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions: 38 - Laboratory, optical and precision equipments (excl. glasses)
CPV Codes: 38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value: Not specified
Lots Value: Not specified
Awards Value: Not specified
Contracts Value: Not specified

Notice Dates

Publication Date: 4 Aug 20262 days ago
Submission Deadline: 18 Aug 20262 weeks to go
Future Notice Date: Not specified
Award Date: Not specified
Contract Period: Not specified - Not specified
Recurrence: Not specified

Notice Status

Tender Status: Active
Lots Status: Active
Awards Status: Not Specified
Contracts Status: Not Specified

Buyer & Supplier

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Contracting Authority (Buyer)

Main Buyer: UNIVERSITY OF STRATHCLYDE
Contact Name: Available with D3 Tenders Premium →
Contact Email: Available with D3 Tenders Premium →
Contact Phone: Available with D3 Tenders Premium →

Buyer Location

Locality: GLASGOW
Postcode: G1 1XU
Post Town: Glasgow
Country: Scotland
Major Region (ITL 1): TLM Scotland
Basic Region (ITL 2): TLM3 West Central Scotland
Small Region (ITL 3): TLM32 Glasgow City
Delivery Location: TLM82 Glasgow City
Local Authority: Glasgow City
Electoral Ward: Anderston/City/Yorkhill
Westminster Constituency: Glasgow North East

Further Information

Notice Documents

https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561520
Supply, Delivery and Installation of Leak Testing Kit - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Leak Testing capability is required for hermetic packages used in photonic and advanced semiconductor packaging.

Notice URLs

Open Contracting Data Standard (OCDS)

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JSON Markdown

The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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