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Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

06 Aug 2026 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde is buying an inductively coupled plasma chemical vapour deposition system, including its supply, delivery and installation. The equipment will support the National Centre for Advanced Semiconductor Packaging, an industry-led facility intended to help UK photonics and power-electronics innovators move from device design to domestic, high-volume semiconductor packaging, testing and metrology. This is a goods procurement, with the equipment delivered to Glasgow. The requirement covers one package of equipment and includes the potential for additional deliveries, such as partial replacement of supplies or installations or extensions to existing supplies and installations. The contract also includes maintenance and warranty arrangements, with community benefits forming part of the requirement. Suppliers of specialist semiconductor, thin-film deposition or related advanced manufacturing equipment should assess the technical specification and installation requirements.

The procurement has reached tender: the University invited offers through an open procedure, with electronic submission. Bids were due by 9 September 2026 at 12:00 UTC, with public bid opening at the same time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The buyer may also request additional deliveries during the contract. There is one lot. Offers are evaluated on quality and price, weighted 60% and 40% respectively. Bids must be submitted in English and remain valid for 180 days after the submission deadline. Electronic ordering and electronic payment will be used, and electronic invoicing is allowed. The process is covered by the Government Procurement Agreement.

This opportunity suits manufacturers, specialist distributors and systems integrators with demonstrable experience supplying and installing inductively coupled plasma chemical vapour deposition equipment or comparable semiconductor processing systems. Bidders must provide three examples showing relevant experience in delivering the required equipment, so established delivery and installation capability is important. The buyer requires an average annual turnover of at least £1.2 million over the last three years, supporting suppliers with an established financial and supply-chain base. Successful suppliers must maintain, or be able to obtain before contract commencement, employers’ liability insurance of £10 million, public and product liability insurance of £10 million, and professional indemnity insurance of £2 million. Businesses able to provide ongoing maintenance and warranty support, replacement installations and community benefits should be well placed to compete.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000839268
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561730
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
6 Aug 20263 weeks ago
Submission Deadline
9 Sep 20262 weeks to go
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561730
    Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.

Open Contracting Data Standard (OCDS)

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