This public procurement record has 1 release in its history.

Tender

05 Aug 2026 at 00:00

Summary of the contracting process

The University of Strathclyde is currently in the tender stage of a procurement process for the supply and delivery of an FPGA based configurable multi-instrument source and detector. With its focus in the education sector, this procurement addresses the need for a sovereign, open-access advanced semiconductor packaging capability in the UK, to mitigate reliance on overseas facilities. Located in Glasgow, the tender invites electronic submissions until 25th August 2026 at noon, with an anticipated award date the same day. This open procedure is classified under the goods industry category, with English as the language for submissions.

This tender presents valuable opportunities for businesses involved in semiconductor technology, photonics, and power electronics, particularly those with expertise in FPGA configurations. Firms that can showcase an average yearly turnover of at least £140,000 over the past three years and hold relevant insurances are positioned well to compete. Small to medium-sized enterprises (SMEs) with experience in scalable packaging solutions and integrated semiconductor systems may find this contract particularly rewarding. With the National Centre for Advanced Semiconductor Packaging part of this initiative, successful tenderers will contribute to a pivotal project designed to fortify the UK's standing in high-volume packaging and testing, promoting onshore technological advancements.

How relevant is this notice?

Notice Title

Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000839270
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561705
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
PCS Notice - Website Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)


CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
5 Aug 2026Yesterday
Submission Deadline
25 Aug 20263 weeks to go
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Contracting Authority (Buyer)

Main Buyer
UNIVERSITY OF STRATHCLYDE
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Post Town
Glasgow
Country
Scotland

Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City

Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561705
    Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

JSON Markdown

The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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