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Supply and Delivery of Swept Laser Source for PIC Measurements 1060nm & 632nm

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

06 Aug 2026 at 01:00

PCS Notice - Website Contract Notice
Summary of the contracting process

The University of Strathclyde is buying swept laser sources for photonic integrated circuit (PIC) measurements at wavelengths of 1060nm and 632nm. The equipment supports the National Centre for Advanced Semiconductor Packaging, an industry-led scale-up facility intended to connect UK device design with domestic semiconductor packaging, testing and metrology. This is a supply contract for specialist photonics and semiconductor measurement equipment, rather than general laboratory supplies. Delivery is required in Glasgow. The requirement may suit manufacturers, specialist distributors and systems suppliers of swept laser sources, particularly those serving photonics, optical communications, semiconductor research or precision measurement facilities. Suppliers should be able to provide the specified equipment and support additional deliveries where required, including partial replacement or extensions to existing supplies and installations.

The procurement reached tender: the University invited offers using an open procedure, with electronic submission. Bids were due by 25 August 2026 at 12:00 UTC, with bid opening scheduled for the same time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The authority may also request additional deliveries, including partial replacement of supplies or installations and extensions to existing supplies or installations. Variants are not allowed, and bids must remain valid for 180 days after the submission deadline. Evaluation includes economic and technical requirements. Bidders need average annual turnover of at least £180,000 over the previous three years and three examples of relevant experience delivering the equipment. Required insurance includes employers’ and public/product liability cover of £10 million each, plus £2 million professional indemnity cover.

This opportunity is aimed at suppliers with established capability in swept laser sources, photonic integrated circuit measurement, optical testing or semiconductor metrology. Strong candidates are likely to combine product expertise with the capacity to supply, install or extend specialist equipment in a research and industrial scale-up environment. Relevant previous delivery experience is essential: bidders must provide three examples showing they can deliver the required equipment. The requirement also favours financially established businesses able to demonstrate sustained turnover and maintain substantial employers’, public and product liability, and professional indemnity insurance. Suppliers should be prepared to support the equipment through maintenance and warranty arrangements, as renewal may be required, and to fulfil further supply or replacement requirements during the relationship. Electronic ordering and payment arrangements may support established equipment suppliers and specialist distributors.

How relevant is this notice?

Notice Information

Notice Title

Supply and Delivery of Swept Laser Source for PIC Measurements 1060nm & 632nm

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for Swept Laser Sources for PIC Measurements 1060nm & 632nm.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for Swept Laser Sources for PIC Measurements 1060nm & 632nm.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000839272
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561719
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
PCS Notice - Website Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
6 Aug 20263 weeks ago
Submission Deadline
25 Aug 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561719
    Supply and Delivery of Swept Laser Source for PIC Measurements 1060nm & 632nm - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for Swept Laser Sources for PIC Measurements 1060nm & 632nm.

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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