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Supply, Delivery and Installation of Matrix Plasma Asher

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

06 Aug 2026 at 01:00

OJEU - F2 - Contract Notice
Summary of the contracting process

The University of Strathclyde is procuring the supply, delivery and installation of a Matrix Plasma Asher for the National Centre for Advanced Semiconductor Packaging in Glasgow. The equipment will support an integrated, industry-led facility for advanced semiconductor packaging, test and metrology, helping UK photonics and power-electronics innovators move from device design to domestic, high-volume packaging. The requirement is for goods, with associated installation. The wider purpose is to reduce reliance on overseas outsourced semiconductor assembly and test facilities, shorten lead times, reduce intellectual-property leakage risk and strengthen domestic supply-chain resilience. This opportunity suits manufacturers, specialist equipment suppliers and authorised distributors able to provide a Matrix Plasma Asher and install it in a semiconductor packaging environment.

The process reached tender: the University invited offers through an open procedure, with electronic submission. The buyer set the tender deadline at 9 September 2026, 12:00 UTC, with bids opened at that time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The authority may also request additional deliveries for partial replacement or extensions to existing supplies and installations. Award evaluation is weighted 60% quality and 40% price. Bids must remain valid for 180 days and be submitted in English; variants are not allowed. Economic requirements include average annual turnover of at least £446,000 over the last three years and insurance of £10 million employers’ liability, £10 million public and product liability, and £2 million professional indemnity.

This opportunity is suited to suppliers with direct experience supplying, delivering and installing plasma ashing equipment for semiconductor, photonics, power-electronics, research or advanced manufacturing facilities. Bidders must provide three examples demonstrating relevant experience in delivering the specified equipment, so established equipment manufacturers, specialist integrators and technically capable authorised distributors are best placed to compete. The requirement calls for sufficient engineering and after-sales capacity to manage delivery, installation, maintenance and warranty support over the contract period and any renewal. Suppliers must be able to meet the stated insurance levels or commit to obtaining them before contract commencement, and should have the financial scale to satisfy the turnover threshold. The project also includes community-benefit requirements.

How relevant is this notice?

Notice Information

Notice Title

Supply, Delivery and Installation of Matrix Plasma Asher

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a Matrix Plasma Asher.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a Matrix Plasma Asher.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000839464
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561751
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
OJEU - F2 - Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
6 Aug 20263 weeks ago
Submission Deadline
9 Sep 20262 weeks to go
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561751
    Supply, Delivery and Installation of Matrix Plasma Asher - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a Matrix Plasma Asher.

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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