This public procurement record has 1 release in its history.

Tender

06 Aug 2026 at 01:00

Summary of the contracting process

The University of Strathclyde is buying and having delivered a swept laser source for photonic integrated circuit (PIC) measurements at 1550 nm. This is a specialised scientific instrument supporting the National Centre for Advanced Semiconductor Packaging, an industry-led facility intended to connect UK device design with domestic semiconductor packaging, testing and metrology. The requirement is classified as laboratory and scientific equipment. The work is for delivery in Glasgow. There is one lot, covering the equipment supply and delivery, with the possibility of additional deliveries for partial replacement or extensions to existing supplies and installations. The buyer is a public university and central purchasing body.

The procurement reached tender: the University invited offers through an open procedure, with bids submitted electronically. The submission deadline and bid opening were set for 25 August 2026 at 12:00 UTC; evaluation was scheduled to start at that time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. Bids must remain valid for 180 days and be submitted in English. The buyer requires average annual turnover of at least GBP 150,000 over the previous three years. Required insurance levels are GBP 10 million employers’ liability, GBP 10 million public and product liability, and GBP 2 million professional risk indemnity. Evaluation includes economic capacity and technical experience, including three relevant examples.

This opportunity suits suppliers of swept laser sources, photonic measurement equipment and related semiconductor or optical laboratory systems. The successful supplier will need to provide equipment suitable for PIC measurements at the 1550 nm wavelength, deliver it to Glasgow and support the associated supply, installation or replacement requirements. Suppliers should be able to demonstrate three comparable examples showing relevant experience in delivering the specified equipment. They also need the financial resilience and insurance arrangements required for a substantial specialist equipment contract, including employers’, public and product liability, and professional risk indemnity cover. Firms able to provide ongoing maintenance and warranty support may be well placed because renewal is linked to those requirements.

How relevant is this notice?

Notice Title

Supply and Delivery of Swept Laser Source for PIC Measurements 1550nm

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Swept Laser Source for PIC Measurements 1550nm.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Swept Laser Source for PIC Measurements 1550nm.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000839470
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561770
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
PCS Notice - Website Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)


CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
6 Aug 20263 weeks ago
Submission Deadline
25 Aug 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland

Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City

Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561770
    Supply and Delivery of Swept Laser Source for PIC Measurements 1550nm - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Swept Laser Source for PIC Measurements 1550nm.

Open Contracting Data Standard (OCDS)

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