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Supply, Delivery and Installation of Rapid Thermal Anneal

University of Strathclyde

This public procurement record has 1 release in its history.

Tender

06 Aug 2026 at 01:00

PCS Notice - Website Contract Notice
Summary of the contracting process

The University of Strathclyde is buying the supply, delivery and installation of a Rapid Thermal Anneal system for the National Centre for Advanced Semiconductor Packaging. The equipment will support an integrated, industry-led scale-up facility for advanced semiconductor packaging, linking UK device design with domestic high-volume packaging, testing and metrology. The wider purpose is to reduce reliance on overseas outsourced semiconductor assembly and test facilities, shorten lead times, reduce intellectual property leakage risk and protect the supply chain from geopolitical disruption. This is a goods requirement for specialist laboratory, optical and precision equipment (CPV 38000000). Delivery and installation are in Glasgow. The procurement is a single requirement, and the University of Strathclyde is the buying organisation and central purchasing body.

The process reached tender: the University invited offers through an open procedure, with electronic submission. The bid deadline set by the buyer is 26 August 2026 at 12:00 UTC, with bid opening at the same time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The buyer may also request additional deliveries for partial replacement or extensions of existing supplies and installations. Bids must remain valid for 180 days and be submitted in English; variants are not allowed. Evaluation requires three relevant previous-experience examples. Bidders must have average annual turnover of at least GBP 226,000 over the last three years and meet insurance requirements of GBP 10 million employer’s liability, GBP 10 million public and product liability, and GBP 2 million professional risk indemnity.

This opportunity suits equipment manufacturers, specialist laboratory technology suppliers and integrators able to provide a Rapid Thermal Anneal system as a complete supply, delivery and installation package. Strong candidates will understand semiconductor processing and the operational requirements of advanced packaging, testing or metrology environments, and will be able to demonstrate three comparable deliveries. The requirement is suited to an established supplier with the technical team, installation capability and supply-chain resilience to support a national scale-up facility. Experience delivering complex precision equipment into research, industrial or semiconductor settings will be particularly relevant. Suppliers should also be prepared to provide maintenance and warranty support, manage potential replacement or extension deliveries, and operate effective electronic ordering, payment and invoicing arrangements.

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Notice Information

Notice Title

Supply, Delivery and Installation of Rapid Thermal Anneal

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Rapid Thermal Anneal.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Rapid Thermal Anneal.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000839501
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561812
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
PCS Notice - Website Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
6 Aug 20263 weeks ago
Submission Deadline
26 Aug 2026Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland
Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City
Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561812
    Supply, Delivery and Installation of Rapid Thermal Anneal - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Rapid Thermal Anneal.

Open Contracting Data Standard (OCDS)

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.

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