This public procurement record has 1 release in its history.

Tender

15 Sep 2026 at 01:00

Summary of the contracting process

The University of Strathclyde is buying a field-programmable gate array (FPGA)-based configurable multi-instrument source and detector, classified under CPV 38000000 for laboratory, optical and precision equipment. This is a goods requirement supporting the National Centre for Advanced Semiconductor Packaging (NCASP), an industry-led facility intended to connect UK device design with domestic semiconductor packaging, testing and measurement. The equipment is intended for use in Glasgow. The wider purpose is to support advanced photonics and power-electronics development, scale-up and high-volume packaging by providing configurable source and detector capability within a sovereign, open-access semiconductor facility. The requirement includes supply and delivery, with potential further deliveries for partial replacement, extensions or additions to the original equipment and installations.

The procurement reached tender: the University invited offers through an open procedure, with electronic submission in English. The bid deadline and bid opening were 18 September 2026 at 12:00 UTC. The contract period is 720 days, with a possible 12-month renewal for required maintenance and warranty. The authority may request additional deliveries, replacements or extensions at its discretion. Bids must remain valid for 180 days. Evaluation requires three examples of relevant previous experience. Bidders need average annual turnover of at least £140,000 over the last three years and must hold or obtain employer’s liability insurance of £10 million, public and product liability insurance of £10 million, and professional indemnity insurance of £2 million. Electronic ordering and payment apply, and electronic invoicing is permitted.

This opportunity suits suppliers of specialist electronic, laboratory, optical or semiconductor test equipment with proven FPGA-based instrumentation capability. Strong candidates will be able to configure, supply, deliver and support a multi-instrument source and detector for advanced research and semiconductor packaging applications, and demonstrate three comparable equipment-delivery projects. The requirement is suited to established businesses with sufficient financial resilience and a supply chain capable of supporting equipment and installations over the contract term, including possible replacement or extension work. Suppliers must be able to meet the specified employer’s, public and product liability, and professional indemnity insurance levels. The opportunity may also suit manufacturers, authorised distributors or specialist integrators able to provide maintenance and warranty support, electronic ordering and payment, and associated technical assistance.

How relevant is this notice?

Notice Title

Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector

Notice Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.

Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

Publication & Lifecycle

Open Contracting ID
ocds-r6ebe6-0000843030
Publication Source
Public Contracts Scotland
Latest Notice
https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=SEP564548
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
PCS Notice - Website Contract Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure
Tender Suitability
Not specified
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)


CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
Not specified
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
15 Sep 2026Yesterday
Submission Deadline
18 Sep 20262 days to go
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
Not specified - Not specified
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Active
Awards Status
Not Specified
Contracts Status
Not Specified

Contracting Authority (Buyer)

Main Buyer
University of Strathclyde
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
GLASGOW
Postcode
G1 1XU
Postcode Area
Glasgow
Country
Scotland

Major Region (ITL 1)
TLM Scotland
Basic Region (ITL 2)
TLM3 West Central Scotland
Small Region (ITL 3)
TLM32 Glasgow City
Delivery Location
TLM82 Glasgow City

Local Authority
Glasgow City
Electoral Ward
Anderston/City/Yorkhill
Westminster Constituency
Glasgow North East

Further Information

Notice Documents

  • https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=SEP564548
    Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.

Open Contracting Data Standard (OCDS)

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